Epoxy resin-polymaleimide composite semiconductor packaging material and preparation method thereof

Abstract

The invention discloses an epoxy resin-polymaleimide composite semiconductor packaging material and a preparation method thereof. The epoxy resin-polymaleimide composite semiconductor packaging material comprises the following components in parts by mass: 40-60 parts of epoxy resin, 20-30 parts of polymaleimide, 2-5 parts of polyethylene, 2-6 parts of amino-silicone oil, 3-5 parts of polysiloxane, 1-4 parts of linolenate, 2-4 parts of chlorinated paraffin, 1-3 parts of carboxyethyl cellulose, 1-3 parts of dioctyl phthalate, 1.2-3.6 parts of sodium benzoate, 1-1.8 parts of oil-based amino acid sodium, 1.6-2.8 parts of maleic anhydride and 0.1-0.5 part of an antioxidant. The impact strength of the composite material is improved obviously since polymaleimide is added; the curing shrinkage rate is reduced, dimensional stability is improved, and the heat resistance, dielectric property and thermal conductivity of the composite material are improved.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for electronic devices, and in particular relates to an epoxy resin-polymaleimide compound semiconductor packaging material and a preparation method thereof. Background technique [0002] In microelectronic integrated circuits and high-power rectifier devices, dense and numerous micro-sized components generate a lot of heat, thermal stress fatigue caused by thermal expansion coefficient mismatch between the chip and packaging materials and poor heat dissipation performance of the chip Overheating has become a major failure mode of microelectronic circuits and devices. The packaging of electronic components has become a bottleneck problem restricting system performance. It is estimated that 30% of the chip's computing power is limited by packaging materials, and its impact has become as important as the chip. The so-called packaging refers to the use of substrates, bottom plates, and ...

AI Technical Summary

Problems solved by technology

Thermosetting resin electronic packaging materials such as epoxy resin have the advantages of cheap price, simple molding process, mature process, and good adjustability. Large molding shrinkage, easy to burst when used at low temperature, high brittleness, various organic additives are easy to cause pollution, components are easy to be damaged by stress, and cannot be recycled, which has caused great pressure on the environment