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A kind of preparation method of organic silicon thermally conductive adhesive sheet

A heat-conducting adhesive sheet and silicone technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problem that the material torque strength is difficult to meet the requirements, bonding materials and substrates Combining the problems of low strength and difficulty in meeting high insulation performance, it achieves the effects of improving insulation performance, reliability and durability, outstanding high and low temperature resistance, and low water absorption

Active Publication Date: 2017-08-08
SHENZHEN ANPIN SILICONE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, thermally conductive adhesive materials generally improve the mechanical properties and insulating properties of the material by compounding the adhesive material with the glass fiber substrate. However, it is found in practice that due to the porous structure of the glass fiber cloth, it is difficult to meet the requirements of high insulating properties. Moreover, in the process of use, the thermal conductivity and insulation properties of the material are likely to be uneven due to uneven pressure during use, and the reliability is reduced. However, when the polyimide insulating substrate is used instead, the bonding strength between the adhesive material and the substrate is low, and separation is easy to occur. Technical issues that make the torque strength of the material difficult to meet the requirements

Method used

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  • A kind of preparation method of organic silicon thermally conductive adhesive sheet
  • A kind of preparation method of organic silicon thermally conductive adhesive sheet
  • A kind of preparation method of organic silicon thermally conductive adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The preparation method of the silicone thermally conductive adhesive sheet is as follows:

[0054] A. Take 0.08% vinyl end-blocking methyl vinyl silicone raw rubber with a molecular weight of 0.08% and 0.50% vinyl end-capping methyl vinyl silicone raw rubber with a molecular weight of 0.50% and a molecular weight of 600,000. 320g of methyl-terminated vinyl silicone raw rubber, 25°C dynamic viscosity of 1000mPa·s and hydrogen content of 0.1% hydrogen-containing silicone oil 7.2g, vinyl content of 2% MQ silicone resin (Guangzhou Kanggu Jia Synthetic Materials Co., Ltd.) 21.6g, γ-methacryloxypropyltrimethoxysilane 1.4g and fumed silica (Cabot lm-150) 18g were kneaded into agglomerates in a kneader, and then divided into three Add 18g of fumed white carbon black (Cabot lm-150) each time, after mixing everything into a ball, raise the temperature to 90°C and continue kneading for 2.5h, then raise the temperature to 150°C and apply vacuum (vacuum degree 0.08-0.09Mpa) for mixi...

Embodiment 2

[0058] The preparation method of the silicone thermally conductive adhesive sheet is as follows:

[0059] A. Take 0.07% vinyl end-capped methyl vinyl silicone raw rubber with a molecular weight of 0.07% and a molecular weight of 0.5% vinyl end-capped vinyl silicone rubber of 800,000 160g of methyl-terminated vinyl silicone raw rubber, 8g of methyl silicone oil with a dynamic viscosity of 100mPa·s at 25°C, 20g of MQ silicone resin (Guangzhou Kanggujia Synthetic Materials Co., Ltd.) with a vinyl content of 0.5% by mass, Put 2g of vinyltriethoxysilane and 10g of fumed silica (Cabot lm-150) in a kneader, knead into a group and add 10g of fumed silica (Cabot lm-150) in three times each time , after mixing everything into a ball, raise the temperature to 110°C and continue kneading for 1.5h, then raise the temperature to 160°C and vacuumize (vacuum degree 0.08-0.09Mpa) and knead for 0.5h, take it out and let it cool naturally to obtain a mixed compound;

[0060] B. Take 1490g of al...

Embodiment 3

[0063] The preparation method of the silicone thermally conductive adhesive sheet is as follows:

[0064] A. Take 1000g of vinyl-terminated methyl vinyl silicone raw rubber with a molecular weight of 0.55% and a molecular weight of 800,000. The dynamic viscosity at 25°C is 1000mPa·s and the hydrogen content is 0.1%. Silicone oil 50g, the mass percentage content of vinyl is 3% MQ silicone resin (Guangzhou Kang Gujia Synthetic Materials Co., Ltd.) 80g, vinyltrimethoxysilane 10g and fumed silica (Cabot lm-150) 50g In the kneader, after kneading into a group, add 50g of fumed silica (Cabot lm-150) three times each time, after mixing everything into a group, raise the temperature to 100°C and continue kneading for 1.5h, then raise the temperature to 140°C Vacuumize (vacuum degree 0.08-0.09Mpa) and knead for 1.5 hours, take out and cool naturally to obtain the mixed rubber;

[0065] B. Take 1400g of alumina powder (DENKA, BAW-05) and dry at 150°C for 3 hours, and cool naturally to ...

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Abstract

The invention belongs to the technical field of adhesive materials, and discloses a method for preparing an organic silicon heat-conducting adhesive sheet, which comprises mixing methyl vinyl silicon raw rubber, fumed white carbon black, silicone resin, and a tackifier to obtain a mixed rubber material. Adding heat-conducting fillers and vulcanizing agents to obtain a heat-conducting silicone rubber mixture, and then rolling and compounding with a silicone-modified polyimide film to obtain a silicone heat-conducting adhesive sheet. The silicone thermally conductive adhesive sheet of the present invention has outstanding structural adhesion and excellent thermal conductivity, and at the same time improves the insulation performance and interlayer bonding force of the adhesive sheet through a special interlayer structure, thereby improving the comprehensive application performance of the adhesive sheet .

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a method for preparing an organic silicon heat-conducting adhesive sheet. Background technique [0002] In the fields of industrial electronics, electrical appliances, communications, etc., with the increase of circuit operating frequency, the development trend of high integration of electronic devices and high-density assembly of products, the heat generation of electronic devices and circuits will continue to increase, and the increase in temperature will affect With the increasing impact of electronics work, the importance of thermal management is becoming more and more important. According to calculations, when electronic devices work between 70 and 80 °C, the reliability of the device will drop by 5% for every 1 °C increase in the operating temperature. The heat dissipation of power devices is a problem that must be considered in the evaluation of product reliabil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C09J183/07C09J183/05C09J11/04C09J11/06C08J5/18C08L79/08C08G73/10
Inventor 李云陈小丹欧阳冲丁武刘硕张耀湘覃剑
Owner SHENZHEN ANPIN SILICONE MATERIAL
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