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Preparation method of solid composite bonding material

A technology for bonding materials and solids, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve problems such as fire accidents, easy to obtain raw materials, good mechanical properties, and good curing effect at room temperature Effect

Inactive Publication Date: 2015-11-11
SUZHOU YUNSHU NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polymer materials are generally flammable or combustible, which is easy to cause fire accidents, and has become an increasingly serious social problem that people are generally concerned about.

Method used

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  • Preparation method of solid composite bonding material
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0020] 100 g of bisphenol A cyanate resin monomer and 60 g of 2,4,6-trimethoxybenzyl acetal pentaerythritol carbonate monomer were reacted at 130° C. for 40 minutes to obtain a heat-resistant resin prepolymer.

[0021] According to the proportions in Table 1, silica sol (solid content is 28%; particle size of silicon dioxide is 150-260 nanometers), polyoxyethylene sorbitan monooleate, 1,3,5-triglycidyl- S-triazinetrione was mixed for 2 hours to obtain a mixture; sequentially add succinic anhydride and nano-boron nitride (200-330 nanometers) into the mixture, stir for 4 hours, then add polytetrafluoroethylene wax powder, m-nitrosulfur acid pyridinium salt, stirred at 60°C for 8 hours; finally added dicyclohexylcarbodiimide and epoxy resin prepolymer, stirred at 105°C for 3 hours to obtain a compound; then put the compound into a mold, and molded (0.2 MPa; 90°C; molding for 30 seconds) to obtain a solid composite adhesive material.

[0022] Table 1 raw material quality

[0023...

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Abstract

The invention relates to a preparation method of a solid composite bonding material. The raw materials are easily-available and simple. There is no complicated reaction existing in the prior art. The prepared solid composite bonding material has an excellent bonding performance, and the normal temperature curing effect is good. When the solid composite bonding material is heated, silica sol will lose water gradually, nano boron nitride will catalyze the organic substances to carry out further reactions so as to form a stable structure, thus the flame retardant performance of the system is further enhanced, and at the same time, the high temperature bonding stability is ensured. The compatibility among the components of the solid composite bonding material is good. The solid composite bonding material has good mechanical properties, an excellent bonding performance, and a heatproof performance, especially has an excellent flame retardant performance, and can meet the application requirements.

Description

technical field [0001] The invention belongs to the technical field of novel composite materials, and in particular relates to a preparation method of a solid composite adhesive material. Background technique [0002] With the development of science and technology, the production technology of various plastic products is becoming more and more mature, and has been widely used in people's lives. Among them, plastic rods are important and widely used plastic varieties. With the development of chemical technology, various Plastic rods prepared from this kind of plastic raw materials are widely used in chemical industry, electronics, exhibition and shop equipment, construction industry, lighting industry, furniture industry and in the advertising industry. [0003] Since the beginning of the 21st century, the global composite material market has grown rapidly, especially in Asia, especially in China. From 2003 to 2008, China's average annual growth rate was 15%, India's was 9....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/04C09J127/18C09J11/04C09J11/06C09J11/08
Inventor 戴晓宸
Owner SUZHOU YUNSHU NEW MATERIAL TECH
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