Copper oxide-nickel oxide periodic heterogeneous hollow structure and preparation method thereof
A hollow structure, copper oxide technology, applied in the direction of anodic oxidation, etc., can solve the problems that the surface activity and surface reaction speed cannot be effectively improved, it is difficult to have a specific surface area, and the synergy cannot be formed, and the preparation method is simple and the high specific surface area is achieved. , Good surface permeability effect
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Embodiment 1
[0035] The concrete steps of preparation are:
[0036] Step 1: first use the anodic oxidation method on the aluminum sheet to obtain a through-hole alumina template with a hole diameter of 45nm; then vapor-deposit a gold film with a thickness of 150nm on one side of the through-hole alumina template.
[0037] In step 2, the aluminum oxide template with a gold film on one side is used as the cathode, and placed in the copper electrolyte and the nickel electrolyte for 6 alternate electrodepositions; wherein, each time the electrodeposition in the copper electrolyte is The deposition voltage is 0.8V and the deposition time is 90s. The deposition voltage is 1.8V and the deposition time is 60s when electrodepositing in nickel electrolyte each time. The anode during electrodeposition is a graphite electrode. After each electrodeposition, the It is placed in deionized water for cleaning to obtain an aluminum oxide template with alternately connected copper pillars and nickel pillars ...
Embodiment 2
[0040] The concrete steps of preparation are:
[0041] Step 1: first use the anodic oxidation method on the aluminum sheet to obtain a through-hole alumina template with a hole diameter of 48nm; then vapor-deposit a gold film with a thickness of 180nm on one side of the through-hole alumina template.
[0042] In step 2, the aluminum oxide template with a gold film on one side is used as the cathode, and placed in the copper electrolyte and the nickel electrolyte for 13 alternate electrodepositions; wherein, each time the electrodeposition in the copper electrolyte is The deposition voltage is 0.9V, and the deposition time is 60s. The deposition voltage is 1.9V, and the deposition time is 10s each time in nickel electrolyte. The anode during electrodeposition is a graphite electrode. After each electrodeposition, the It is placed in deionized water for cleaning to obtain an aluminum oxide template with alternately connected copper pillars and nickel pillars placed in the holes ...
Embodiment 3
[0045] The concrete steps of preparation are:
[0046] Step 1: first use the anodic oxidation method on the aluminum sheet to obtain a through-hole alumina template with a hole diameter of 50 nm; then vapor-deposit a gold film with a thickness of 200 nm on one side of the through-hole alumina template.
[0047] In step 2, the aluminum oxide template with a gold film deposited on one side is used as the cathode, and placed in the copper electrolyte and the nickel electrolyte for 21 alternate electrodepositions; wherein, each time the electrodeposition in the copper electrolyte is The deposition voltage is 1V and the deposition time is 45s. The deposition voltage is 2V and the deposition time is 90s each time in nickel electrolyte. The anode during electrodeposition is a graphite electrode. After each electrodeposition, it is placed Wash in deionized water to obtain an aluminum oxide template with alternately connected copper pillars and nickel pillars placed in the holes and go...
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