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Preparation method of epoxy resin microporous materials

A technology of epoxy resin and microporous materials, which is applied in the field of preparation of microporous materials, can solve the problems of low controllability and repeatability of product performance, can not be called microporous foam materials, and reduce material density, etc., and achieves good solubility. ability, reduced cell size, and the effect of good diffusion properties

Inactive Publication Date: 2015-11-25
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the above method has successfully prepared epoxy resin foam material, which reduces the material density and has certain application value, the cell size of the prepared material is greater than 100 μm, and the number of cells is less than 10 6 piece / cm 3 , can not be called microcellular foam material, and product performance controllability and low repeatability

Method used

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  • Preparation method of epoxy resin microporous materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] (1) Add bisphenol A type epoxy resin and 2-ethyl-4-methylimidazole with an epoxy value of 0.11 to 0.14eq / 100g into dichloromethane at a mass ratio of 20:1, and place on a magnetic stirrer After stirring for 1 hour, a mixed solution was obtained, and after the mixed solution was placed in a vacuum oven for vacuum drying, epoxy resin powder was obtained, and the obtained sample was marked as A;

[0019] (2) Place sample A in a hot press at 90°C for 30 minutes under a pressure of 18 MPa, then cool naturally to room temperature, and the obtained sample is marked as B;

[0020] (3) Place sample B in an autoclave and feed supercritical CO 2 Fluid and temperature control, keep sample B in a 36°C, 9MPa autoclave for 72 hours, and quickly release the pressure after the end of the pressure keeping, the obtained sample is marked as C;

[0021] (4) Foam sample C in a constant temperature silicone oil bath at 120°C for 15 seconds. After foaming, place it in an ice-water bath to coo...

Embodiment 2

[0026] (1) Add bisphenol A type epoxy resin and 2-ethyl-4-methylimidazole with an epoxy value of 0.11 to 0.14eq / 100g into dichloromethane at a mass ratio of 20:1, and place on a magnetic stirrer After stirring for 2 hours, a mixed solution was obtained, and after the mixed solution was placed in a vacuum oven for vacuum drying, epoxy resin powder was obtained, and the obtained sample was marked as A;

[0027] (2) Place sample A in a hot press at 100°C and press it under a pressure of 20 MPa for 15 minutes, then naturally cool to room temperature, and the obtained sample is marked as B;

[0028] (3) Place sample B in an autoclave and feed supercritical CO 2 Fluid and temperature control, keep sample B in a 40°C, 10MPa autoclave for 24 hours, and quickly release the pressure after the end of the pressure keeping, the obtained sample is marked as C;

[0029] (4) Place sample C in a constant temperature silicone oil bath at 110°C to foam for 15 seconds. After foaming, place it in...

Embodiment 3

[0033] (1) Add bisphenol A type epoxy resin and 2-ethyl-4-methylimidazole with an epoxy value of 0.11 to 0.14eq / 100g into dichloromethane at a mass ratio of 20:1, and place on a magnetic stirrer After stirring for 2 hours, a mixed solution was obtained, and after the mixed solution was placed in a vacuum oven for vacuum drying, epoxy resin powder was obtained, and the obtained sample was marked as A;

[0034] (2) Place sample A in a hot press at 110°C and press it under a pressure of 20 MPa for 10 minutes, then naturally cool to room temperature, and the obtained sample is marked as B;

[0035] (3) Place sample B in an autoclave and feed supercritical CO 2 Fluid and temperature control, keep sample B in an autoclave at 40°C and 8MPa for 48 hours, and quickly release the pressure after the end of the pressure keeping, and the obtained sample is marked as C;

[0036] (4) Foam sample C in a constant temperature silicone oil bath at 130°C for 5 seconds. After foaming, place it in...

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Abstract

The invention discloses a preparation method of epoxy resin microporous materials in order to solve the technical problems that epoxy resin foam materials prepared through an existing method are large in cell size and small in number of cells. According to the technical scheme, bisphenol-A epoxy resin and 2-ethyl-4 methylimidazole serve as raw materials, and the uniform-structure epoxy resin microporous materials are prepared through pressing forming of pre-curing sheets, gas saturation, high-temperature foaming and post-curing treatment. According to the preparation method, environment-friendly supercritical CO2 serves as foaming agents, because supercritical CO2 fluid has good dissolving capacity and diffusion performance, the average cell size of the prepared epoxy resin microporous materials is reduced to 5.84-20.2 microns from the 100 microns in the technical background, and the minimum cell size reaches 5.84 microns. The cell density is increased to 1.09*108-1.47*109 / cm<3> from the 106 / cm<3> in the technical background, and the maximum cell density reaches 1.47*109 / cm<3>.

Description

technical field [0001] The invention relates to a preparation method of a microporous material, in particular to a preparation method of an epoxy resin microporous material. Background technique [0002] Microporous polymer refers to a cell size of about 10 μm and a cell density of about 10 9 piece / cm 3 foamed polymer material. Microporous polymers have the characteristics of light weight, high impact strength, long fatigue life, and good thermal stability. They are the main direction of future development in the field of polymer foam materials. Epoxy resins have excellent heat resistance and mechanical properties, and are widely used in the preparation of foam materials. At present, the preparation methods of epoxy resin foam materials mainly include chemical foaming method, physical foaming method and hollow microsphere method. The epoxy resin foam material prepared by the above method has larger cell size and less cell number, which cannot meet the requirements of mic...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08J9/12
Inventor 张广成范晓龙樊勋李建通马忠雷
Owner NORTHWESTERN POLYTECHNICAL UNIV
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