Point, line, surface three-dimensional carbon material composite heat-conduction silica gel and preparation method thereof

A three-dimensional, heat-conducting silica gel technology, applied in the field of heat dissipation, can solve the problems of poor dispersion of graphene materials, difficulty in forming a heat-conducting network, and no solution, etc., and achieve low cost, enhanced dispersion, and excellent balance between thermal conductivity and insulation Effect

Active Publication Date: 2015-12-09
江苏华永烯科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If graphene can be combined with conductive silica gel, it is possible to improve its thermal conductivity. However, there are many problems in the compounding of graphene: it is difficult to form a stable and continuous thermal network; due to the two-dimensional characteristics of graphene sheets, The introduction o

Method used

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  • Point, line, surface three-dimensional carbon material composite heat-conduction silica gel and preparation method thereof
  • Point, line, surface three-dimensional carbon material composite heat-conduction silica gel and preparation method thereof

Examples

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Effect test

Embodiment 1

[0073] This embodiment provides a point, line, surface three-dimensional carbon material composite heat-conducting silica gel and a preparation method thereof. The method includes the following steps:

[0074] (1) Preparation of surface-modified graphene

[0075] Graphene was prepared with reference to Example 1 and Example 2 in CN103771404A, and the yield of prepared graphene was greater than 95%. Among them, the yield of graphene with 5-10 layers is greater than 80%, the yield of graphene with less than 5 layers is lower than 10%, and the sheet diameter is 5-50 μm;

[0076] 100g of the prepared graphene is packed into a ball mill jar and mixed with 200ml of ethanol for ball milling, the ball milling speed is 300 rpm, and the graphene powder is collected after ball milling for 1 hour and dried for subsequent use;

[0077] The graphene after taking out 10g ball milling is dissolved in 500ml concentrated nitric acid (mass fraction is 55%) and carries out surface functionalizat...

Embodiment 1 and comparative example 1

[0106] Embodiment 1 and comparative example 1 performance test of heat-conducting silica gel

[0107] According to the laser flash method, the thermal conductivity of the point, line and plane three-dimensional carbon material composite thermal silica gel obtained in Example 1 is 4.79W / m.k, and the thermal conductivity of the surface-modified graphene composite thermal silica gel obtained in Comparative Example 1 is 1.46W. / m.k, the thermal conductivity of the obtained surface-modified carbon nanotube composite heat-conducting silica gel is 1.15W / m.k, the thermal conductivity of the obtained surface-modified carbon nanosphere composite heat-conducting silica gel is 0.79W / m.k, the obtained surface-modified graphene / surface-modified The thermal conductivity of the carbon nanotube composite thermally conductive silica gel is 2.38W / m.k, and the thermal conductivity of the obtained surface-modified graphene / surface-modified carbon nanosphere composite thermally conductive silica gel...

Embodiment 2

[0112] This embodiment provides a point, line, and surface three-dimensional carbon material composite heat-conducting silica gel and a preparation method thereof, the method including:

[0113] (1) prepare surface-modified graphene by the same method of embodiment 1;

[0114] (2) Preparation of surface modified carbon nanotubes

[0115] 30g carbon nanotubes are dissolved in 1000ml concentrated hydrochloric acid (mass fraction is 35%) and carry out acidification treatment, then filter with filter paper and repeatedly wash with deionized water until the pH value is equal to 7, collect surface modified carbon nanotube powder and bake dry processing standby;

[0116]50g of carbon nanospheres were dissolved in 1000ml of concentrated sulfuric acid (mass fraction is 95%) for acidification, then filtered with filter paper and repeatedly washed with deionized water until the pH value was equal to 7, the surface modified carbon nanotube powder was collected and baked dry processing s...

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Abstract

The present invention provides a point, line, surface three-dimensional carbon material composite heat-conduction silica gel and a preparation method thereof. The composite heat-conduction silica gel comprises, by weight, 0.1-30% of surface-modified graphene, 0.1-30% of surface-modified carbon nano-tubes, 0.1-30% of surface-modified carbon nano-spheres, and the balance of silica gel, wherein the sum of the mass fractions of the surface-modified graphene, the surface-modified carbon nano-tubes and the surface-modified carbon nano-spheres is more than or equal to 10%, a mass ratio of the surface-modified graphene to the surface-modified carbon nano-tubes to the surface-modified carbon nano-spheres is 1:0.5-2:0.5-4, and the surface-modified graphene, the surface-modified carbon nano-tubes and the surface-modified carbon nano-spheres are prepared through treatment modification with strong acids. According to the present invention, the solubilities and the dispersions of the graphene, the carbon nano-tubes and the carbon nano-spheres in the silica gel are effectively improved, and the three modified carbon materials form the stable and continuous three-dimensional heat-conduction network in the silica gel so as to substantially improve the thermal conductivity of the heat-conduction silica gel.

Description

technical field [0001] The invention relates to a carbon material composite heat-conducting silica gel and a preparation method thereof, in particular to a three-dimensional point, line and surface carbon material composite heat-conduction silica gel and a preparation method thereof, belonging to the technical field of heat dissipation. Background technique [0002] In recent years, all kinds of electronic products have grown rapidly, the integration of electronic equipment and industrial equipment has become higher and higher, the performance of devices has been greatly improved, and the power has increased, while the feature size has continued to shrink. This makes various electronic devices accumulate a lot of heat per unit area during use. If it is not quickly conducted to the external environment, it will greatly affect the efficiency of electronic components and significantly reduce their service life. [0003] At present, the main products on the market are to dissipa...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08K13/06C08K9/06C08K9/02C08K3/04C08K7/24C08K7/18C08K3/08C08K3/22
Inventor 张利强李永峰
Owner 江苏华永烯科技有限公司
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