Method for preparing negative thermal expansion material Sc2Mo3O12 film

A negative thermal expansion material, sc2mo3o12 technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of phase change negative thermal expansion response temperature range, high heat treatment temperature, difficult practical application, etc. The effect of wide thermal expansion response temperature range, low heat treatment temperature, stable and good negative thermal expansion performance

Active Publication Date: 2015-12-23
YANGZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In recent years, the research on negative thermal expansion thin film materials has just started, and the research reports on related negative thermal expansion thin film materials mainly focus on AM 2 o 8 ZrW series of negative thermal expansion materials 2 o 8 Thin films, study finds AM 2 o 8 The series of negative thermal expansion films all have many defects such as high heat treatment temperature, need for quenching, phase transition and narrow negative thermal expansion response temperature range, making it difficult to put into practical applications

Method used

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  • Method for preparing negative thermal expansion material Sc2Mo3O12 film
  • Method for preparing negative thermal expansion material Sc2Mo3O12 film
  • Method for preparing negative thermal expansion material Sc2Mo3O12 film

Examples

Experimental program
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Effect test

Embodiment 1

[0022] 1. Target preparation:

[0023] to Sc 2 o 3 and MoO 3 As the raw material, weigh the mixed materials according to the molar ratio of 1:3, place them in alcohol for ball milling for 12 minutes, dry the raw materials in a 60°C oven after ball milling, grind them with an agate mortar for 0.5h, and then add the precursor The total mass of 3% polyvinyl alcohol is ground to make it evenly mixed, then cold-pressed at 50MPa, degummed at 500°C for 0.5h, sintered at 750°C for 6h, and cooled in the furnace to obtain Sc 2 Mo 3 o 12 ceramic target;

[0024] 2. The quartz substrate is cleaned and activated by conventional processes;

[0025] Put the quartz substrate in H 2 SO 4 :H 2 o 2 :H 2 Ultrasonic cleaning in the solution of O=1:1:2 for 5 minutes, pour off the acid solution, clean with deionized water, and ultrasonically clean with acetone for 5 minutes, and then immerse the cleaned quartz substrate in absolute ethanol solution for use , before sending the substrate ...

Embodiment 2

[0031] 1. Target preparation:

[0032] to Sc 2 o 3 and MoO 3 As the raw material, weigh the mixed materials according to the molar ratio of 1:3, place them in alcohol for ball milling for 18 hours, dry the raw materials in an oven at 80°C after ball milling, grind for 0.7 hours with an agate mortar, and then add the precursor The total mass of 4% polyvinyl alcohol is ground to make it evenly mixed, then cold-pressed at 100MPa, debinding at 500°C for 0.7h, sintered at 900°C for 12h, and cooled in the furnace to obtain Sc 2 Mo 3 o 12 ceramic target;

[0033] 2. The quartz substrate is cleaned and activated by conventional processes;

[0034] Put the quartz substrate in H 2 SO 4 :H 2 o 2 :H 2 Ultrasonic cleaning in the solution of O=1:1:2 for 5 minutes, pour off the acid solution, clean with deionized water, and ultrasonically clean with acetone for 5 minutes, and then immerse the cleaned quartz substrate in absolute ethanol solution for use , before sending the subst...

Embodiment 3

[0040] 1. Target preparation:

[0041] to Sc 2 o 3 and MoO 3 As the raw material, weigh the mixed materials according to the molar ratio of 1:3, put them into the ball mill in alcohol for 24 hours, dry the raw materials in a 100°C oven after ball milling, grind them with an agate mortar for 1 hour, and then add 5% polyvinyl alcohol by mass, grind to mix evenly, then cold press molding at 150MPa, debinding at 500°C for 1h, sintering at 1150°C for 24h, and get Sc after cooling in the furnace 2 Mo 3 o 12 ceramic target;

[0042] 2. The quartz substrate is cleaned and activated by conventional processes;

[0043] Put the quartz substrate in H 2 SO 4 :H 2 o 2 :H 2 Ultrasonic cleaning in the solution of O=1:1:2 for 5 minutes, pour off the acid solution, clean with deionized water, and ultrasonically clean with acetone for 5 minutes, and then immerse the cleaned quartz substrate in absolute ethanol solution for use , before sending the substrate into vacuum, dry the surfa...

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Abstract

The invention discloses a method for preparing a negative thermal expansion material Sc2Mo3O12 film, and belongs to the technical field of inorganic functional film material preparing. The method includes the specific step of preparing the negative thermal expansion Sc2Mo3O12 film with a pulse laser method. The method has the beneficial effects that the Sc2Mo3O12 film is prepared with the pulse laser deposition method; and as for the Sc2Mo3O12 film, the negative thermal expansion response temperature range is wide, performance is stable, preparing temperature is low, quenching is avoided, and the heat processing technology is simple. The Sc2Mo3O12 film deposited with the pulse laser deposition method and chemical components of a target material keep good coincidence; and meanwhile escaped particles have high energy, growth of the film is facilitated, the prepared film is high in quality, and the preparing process has good repeatability.

Description

technical field [0001] The invention belongs to the technical field of preparation of inorganic functional film materials, in particular to a negative thermal expansion material Sc 2 Mo 3 o 12 The method of film preparation. Background technique [0002] Materials that "shrink with heat and expand with cold" in volume as the temperature changes are negative thermal expansion materials. A 2 m 3 o 12 (A=Sc, Yb, In, Y, etc.; M=W, Mo) series of negative thermal expansion materials have been developed rapidly in recent years because of their excellent performance. sc 2 Mo 3 o 12 It is an excellent negative thermal expansion compound in this series, and its negative thermal expansion coefficient is -3.79×10 in the temperature range of -178K to 1053K -6 K -1 . This excellent property enables the negative thermal expansion material to be used alone or to prepare composite materials, thereby precisely controlling the expansion coefficient of the material. It has broad app...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/28C23C14/08
Inventor 张志萍刘红飞杨露潘坤旻曾祥华陈小兵
Owner YANGZHOU UNIV
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