Composition of fingerprint-resistant layer consisting of a plurality of thin films and preparation method therefor
An anti-fingerprint layer and composition technology, applied in the direction of chemical instruments and methods, coatings, other chemical processes, etc., can solve the problems of poor performance, high investment costs, high failure rate, etc., to reduce sticking time and save time cost, productivity improvement effect
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Embodiment 1
[0077] 90% by weight of SiO mixed with powder 2 , 6 weight percent Al 2 o 3 , 2 weight percent ZrO 2 , 2 weight percent TiO 2 Afterwards, polyvinyl alcohol (PVA), polyethylene glycol (PEG) and oleic acid were mixed as a binder in a ratio of 5:2:3, and then 1.2% by weight of the total powder was added and spray-dried. at 600kg / cm 2 After stamping the spray-dried powder under high pressure, it was sintered at 1150°C for 6 hours.
[0078] After placing the tempered glass in a chamber that can perform vacuum decompression, place the sintered substrate at the place where electron beam evaporation is performed, and place the anti-fingerprint chemical at the place where resistance heating evaporation is performed, and then use a vacuum pump to vacuum Decompress until 1.8×10 -4 Torr, and then use argon to etch the substrate. After the substrate has been etched, adjust the chamber to 1.5 x 10 -4 Torr, 80° C., and vapor deposition of the substrate was carried out by using an ele...
Embodiment 2
[0081] 90% by weight of SiO mixed with powder 2 , 8 weight percent Al 2 o 3 , 2 weight percent ZrO 2 Afterwards, polyvinyl alcohol, polyethylene glycol, and oleic acid were mixed as a binder in a ratio of 5:2:3, and then 1.5% by weight of the total powder was added and spray-dried. at 600kg / cm 2 After stamping the spray-dried powder under high pressure, it was sintered at 1150°C for 6 hours.
[0082] at 550kg / cm 2 After stamping the spray-dried powder under high pressure, it was sintered at 1200°C for 8 hours.
[0083] After placing the tempered glass in a chamber that can perform vacuum decompression, place the sintered substrate at the place where electron beam evaporation is performed, and place the anti-fingerprint chemical at the place where resistance heating evaporation is performed, and then use a vacuum pump to vacuum Decompress until 1.8×10 -4 Torr, and then use argon to etch the substrate. After the substrate has been etched, adjust the chamber to 1.5 x 10 ...
Embodiment 3
[0086] 90% by weight of SiO mixed with powder 2 , 6 weight percent Al 2 o 3 , 4 weight percent TiO 2 Afterwards, polyvinyl alcohol, polyethylene glycol, and oleic acid were mixed as a binder in a ratio of 5:2:3, and then 1.5% by weight of the total powder was added and spray-dried. at 550kg / cm 2 After stamping the spray-dried powder under high pressure, it was sintered at 1100°C for 10 hours.
[0087] After placing the tempered glass in a chamber that can perform vacuum decompression, place the sintered substrate at the place where electron beam evaporation is performed, and place the anti-fingerprint chemical at the place where resistance heating evaporation is performed, and then use a vacuum pump to vacuum Decompress until 1.8×10 -4 Torr, and then use argon to etch the substrate. After the substrate has been etched, adjust the chamber to 1.5 x 10 -4 Torr, 80° C., and vapor deposition of the substrate was carried out by using an electron beam method.
[0088] Next, t...
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