A kind of heat conduction plate material for electronic equipment and preparation method thereof

A technology of electronic equipment and thermal conductive plate, which is applied in the field of thermal conductive plate-like materials for electronic equipment and its preparation, can solve the problems such as very high requirements for two-phase compatibility, complicated synthesis methods, and the inability of plate-like thermally conductive materials to meet the needs of industrialization. To achieve the effect of good curing effect, reasonable composition and good mechanical properties

Active Publication Date: 2017-06-30
苏州宝达冷热设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the synthesis method is very cumbersome, and organic-inorganic hybrid materials have very high requirements for the compatibility of the two phases.
At the same time, with the development of electronic equipment, electronic materials, especially thin film materials, are required to develop in the direction of ultra-thin. At present, plate-shaped heat-conducting materials for electronic equipment cannot meet the needs of industrialization.

Method used

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  • A kind of heat conduction plate material for electronic equipment and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0018] (1) Mix 18g of graphene and 1g of polyvinylpyrrolidone to obtain pretreated graphene; add 36g of N-methylphenethylamine to 50g of ethanol, stir and mix for 20 minutes, then add 12g of silicon nitride, mix for 1 hour, and then add The above-mentioned pretreated graphene was stirred at 50°C for 25 minutes to obtain a mixture;

[0019] (2) Add 100g of bis((3,4-epoxycyclohexyl)methyl)adipate to 150g of ethylene glycol, stir at 150°C for 15 minutes, then add 6g of 3-tridecafluorohexyl propylene, adjust the temperature At 90°C, add 0.1g of magnesium chips, stir at 90°C for 2 hours; then add 6g of alumina; stir to obtain fluorine-containing epoxy;

[0020] (3) Add 50 g of the mixture prepared in step (1) to 100 g of the fluorine-containing epoxy prepared in step (2); after stirring for 40 minutes, add 0.3 g of thiocyano-1-(2-aminophenyl)ethanone, Stir for 1 hour to obtain a precursor; the precursor is subjected to rotary evaporation to remove the solvent, then placed in a mold, an...

Embodiment 2

[0022] (1) Mix 18g of graphene and 1g of polyvinylpyrrolidone to obtain pretreated graphene; add 36g of N-methylphenethylamine to 50g of ethanol, stir and mix for 20 minutes, then add 12g of silicon nitride, mix for 1 hour, and then add The above-mentioned pretreated graphene was stirred at 50°C for 25 minutes to obtain a mixture;

[0023] (2) Add 100g of bis((3,4-epoxycyclohexyl)methyl)adipate to 150g of ethylene glycol, stir at 150°C for 15 minutes, then add 6g of 3-tridecafluorohexyl propylene, adjust the temperature At 90°C, add 0.1g of magnesium chips, stir at 90°C for 2 hours; then add 6g of alumina; stir to obtain fluorine-containing epoxy;

[0024] (3) Add 50 g of the mixture prepared in step (1) to 150 g of the fluorine-containing epoxy prepared in step (2); after stirring for 40 minutes, add 0.3 g of thiocyano-1-(2-aminophenyl)ethanone, Stir for 1 hour to obtain a precursor; the precursor is subjected to rotary evaporation to remove the solvent, then placed in a mold, an...

Embodiment 3

[0026] (1) Mix 18g of graphene and 1g of polyvinylpyrrolidone to obtain pretreated graphene; add 36g of N-methylphenethylamine to 50g of ethanol, stir and mix for 20 minutes, then add 12g of silicon nitride, mix for 1 hour, and then add The above-mentioned pretreated graphene was stirred at 50°C for 25 minutes to obtain a mixture;

[0027] (2) Add 100g of bis((3,4-epoxycyclohexyl)methyl)adipate to 150g of ethylene glycol, stir at 150°C for 15 minutes, then add 6g of 3-tridecafluorohexyl propylene, adjust the temperature At 90°C, add 0.1g of magnesium chips, stir at 90°C for 2 hours; then add 6g of alumina; stir to obtain fluorine-containing epoxy;

[0028] (3) Add 50 g of the mixture prepared in step (1) to 125 g of the fluorine-containing epoxy prepared in step (2); after stirring for 40 minutes, add 0.3 g of thiocyano-1-(2-aminophenyl)ethanone, Stir for 1 hour to obtain a precursor; the precursor is subjected to rotary evaporation to remove the solvent, then placed in a mold, an...

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Abstract

The invention relates to a heat conduction plate-shaped material for electronic equipment and a preparation method thereof. The method comprises the steps that graphene and povidone are mixed, N-methyl phenyl ethylamine is added into ethyl alcohol, then, silicon nitride is added, and then the preprocessed graphene is added to obtain a mixture; bi((3,4-epoxy cyclohexyl)methyl)adipate is added into ethylene glycol, 3-tridecafluorohexyl propylene and magnesium chips are added, and then aluminum oxide is added; stirring is performed to obtain fluorinated epoxide; the mixture is added into the fluorinated epoxide; stirring is performed, and then thiocyanate-1-(2-aminophenyl)ketone is added to obtain a precursor; rotary evaporation is performed on the precursor to remove a solvent, then, the precursor is placed into a mold for performing thermocuring for 0.5 h at the temperature of 120 DEG C, 1 h at the temperature of 150 DEG C and 1.5 h at the temperature of 180 DEG C to obtain the heat conduction plate-shaped material for the electronic equipment. The preparation method is wide in raw material source, the preparation process is simple and controllable, only conventional operation is needed, and industrialization is facilitated.

Description

Technical field [0001] The invention belongs to the technical field of electronic materials, and specifically relates to a thermally conductive plate-shaped material for electronic equipment and a preparation method thereof. Background technique [0002] Thermal conductive materials are widely used in the field of electronic equipment, especially plate-shaped materials, which are widely used in electronic heat exchange devices and electronic information engineering devices. For a long time, metal materials have been widely used as heat-conducting materials, but metals are relatively expensive and are not resistant to chemicals, limiting their applications. Researchers applied functional coatings on metal surfaces to improve the corrosion resistance of metal thermal conductive materials, but greatly reduced thermal conductivity. Composite materials are important basic materials for high-tech fields such as information technology, biotechnology, energy technology, and national def...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/30C08G59/50C08K9/04C08K3/04C08K3/22C08K3/28
Inventor 杨和荣
Owner 苏州宝达冷热设备有限公司
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