Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method

A technology for managing device and metal concentration, applied in the direction of using sonic/ultrasonic/infrasonic waves to analyze fluids, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as product quality deterioration

Inactive Publication Date: 2016-01-27
HIRAMA LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, if the etching process is repeated, the dissolved indium will be precipitated in the etching solution, causing etching residues and the like to deteriorate the quality of the product.

Method used

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  • Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method
  • Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method
  • Etching solution managing apparatus, dissolved metal concentration measuring apparatus and dissolved metal concentration measuring method

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Experimental program
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Effect test

no. 1 approach 〕

[0066] figure 1 It is a system diagram of an etching processing mechanism 100 including the etching liquid management device according to the first embodiment of the present invention.

[0067] The etchant management device of this embodiment is mainly used in the etching process of etching a metal film or a metal compound film, where the etchant is an acid-containing aqueous solution and the management of the acid concentration and dissolved metal concentration of the etchant is important. exist figure 1 In the system diagram of the figure, it is provided with: an etching treatment part A connected to the etching solution management device of the present invention and including an etching treatment tank 1 in which an etching solution maintained and managed at a predetermined component concentration is stored; The etchant circulation unit B that circulates and stirs the etchant stored in the etchant treatment tank 1; the dissolved metal recovery and removal unit C that recove...

no. 2 approach 〕

[0185] Image 6 It is a system diagram of the etching processing mechanism 110 including the etching liquid management device according to the second embodiment of the present invention. The etchant management device of the second embodiment differs from the etchant management device of the first embodiment in that, in the measuring section E of the etchant management device of the first embodiment, the first physical property value measuring device 17 , In addition to the second physical property value measuring device 18, a third physical property value measuring device (third physical property value measuring means) 19 is further provided. The third physical property value measuring device 19 measures a third physical property value related to the concentration of the oxidizing agent in the etching solution. By utilizing the previously obtained correlation between the concentration of the oxidizing agent in the etching solution and the third physical property value, the co...

no. 3 approach 〕

[0193] The etchant management device according to the third embodiment of the present invention is configured by replacing the first physical property value measuring device 17 of the etchant management device according to the first embodiment with a device for measuring at least a physical property value related to the acid concentration of the etchant. The measuring device replaces the second physical property value measuring device 18 with a measuring device that measures at least the physical property value related to the dissolved metal concentration of the etching solution, and has the physical property value of the etching solution measured by the above measuring device and utilizes multivariate analysis. Method (for example, multiple regression analysis method) to calculate the acid concentration of the etching solution and the calculation function (calculation mechanism) of the dissolved metal concentration. The etching treatment mechanism including the etchant managem...

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Abstract

The invention provides an etching solution managing apparatus, a dissolved metal concentration measuring apparatus and a dissolved metal concentration measuring method that can monitor the concentration of the etching solution and the concentration of the dissolved metal so that a replenisher is automatically supplied in a concentration fixed way and the dissolved metal is separated and recycled. The etching solution managing apparatus comprises a first property value measurement mechanism that measures a first property value related to the acid concentration of the etching solution; a second property value measurement mechanism that measures a second property value related to the concentration of the dissolved metal; a replenisher transmission controlling mechanism that controls the transmission of the supplied replenisher based on the relation between the acid concentration and the first property value and the measurement result of the first property value; a dissolved metal recycling and removing mechanism hat recycle and remove the dissolved metal based on the relation between the concentration of the dissolved metal and the second property value and the measurement result of the second property value.

Description

technical field [0001] The present invention relates to an etchant management device, a dissolved metal concentration measurement device, and a dissolved metal concentration measurement method, and more particularly to an etchant for adjusting the concentration of an etchant whose concentration fluctuates over time due to etching and recovering and removing dissolved metals A management device, a device for measuring dissolved metal concentration, and a method for measuring dissolved metal concentration. Background technique [0002] In etching in the manufacturing process of a semiconductor or a liquid crystal substrate, an etchant having a liquid composition appropriately adjusted according to an object to be etched is circulated or stored in an etching tank for repeated use. When the etching object is a metal compound film such as a metal film, a metal alloy film, or a metal oxide film, etchant mainly uses an etching solution composed of an acid or an oxidizing agent, or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D11/13G01N27/06G01N29/02H01L21/67
Inventor 中川俊元白井浩之
Owner HIRAMA LAB
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