Manufacturing method of capacitive touch screen

Abstract

The invention relates to a touch screen technology and discloses a manufacturing method of a capacitive touch screen. The manufacturing method comprises the following steps: according to an edge frame pattern needed by the appearance of the touch screen, covering a panel base material with insulating printing ink to form an edge frame pattern outside a touch screen window; printing a sensor circuit for detecting a touch position on a transparent conductive coating; meanwhile, covering the insulating printing ink and the transparent conductive coating with conductive printing ink; and extending the transparent conductive coating to the back surface of the insulating printing ink, so as to do circuit processing outside the window. The manufacturing process of the capacitive touch screen is relatively simple, the production cost is relatively low and the production efficiency is improved; and actual conditions and large-batch production requirements of middle-scale and small-scale enterprises can be met very well.

Description

technical field [0001] The invention relates to touch screen technology, in particular to a manufacturing method of a capacitive touch screen. Background technique [0002] As a brand-new computer input device, capacitive touch screen is mainly used for man-machine dialogue operations such as information query, industrial control, military command, and multimedia teaching. [0003] At present, the common projected capacitive touch screen on the market generally has a circuit process on the glass substrate: first, apply photoresist on the surface of indium tin oxide glass (ITOGLASS) coated with molybdenum, aluminum and molybdenum, and then cover the unnecessary parts with film. part, after exposure and development, cure the photoresist on the part not covered by the film, remove the photoresist that is not covered by the film and then back-plate molybdenum, aluminum and molybdenum, and finally remove the photoresist that is not covered by the film Resist, after cleaning, lea...

AI Technical Summary

Problems solved by technology

[0004] However, the manufacturing process of this yellow light process is complicated, the requirements on the environment and equipment are very high, and the production cost is high; if the circuit design scheme is changed, the mask (Mask) used for lithography also needs to be redesigned and manufactured, which greatly improves The production cost is increased; and there are many steps in the production process, which seriously limits the production yield

[0005] In addition, when plating the indium tin oxide (ITO) layer, generally a part is plated on the substrate, and a part is plated on the insulating panel. There is a height difference at the connection, so a fault will occur at the connection, and an open circuit of the line will occur. , causing the touch to fail