Flexible compound silicate heat-preservation board material and preparation method thereof

Abstract

The invention discloses a flexible compound silicate heat-preservation board material and a preparation method thereof and belongs to the technical field of heat-preservation materials. The flexible compound silicate heat-preservation board material provided by the invention is prepared by taking organic fibers and sepiolite as main materials, adding silicon dioxide, a binding agent, a flexible agent and a surfactant through compounding. The prepared flexible compound silicate heat-preservation board material does not contain asbestos and does not pollute the environment; the flexible compound silicate heat-preservation board material can be bent, is convenient to construct, and has the advantages of light weight, good flexibility, high rebound rate, good thermal stability, low heat conductivity coefficient, good heat-preservation and heat insulation performances and the like. The flexible compound silicate heat-preservation board material is suitable for heat preservation of products including equipment, containers, pipelines and the like of chemical engineering, petroleum, thermoelectricity and other enterprise and public institutions. The method has the advantages of low cost, simplicity in operation, easiness of industrialization and the like.

Description

technical field [0001] The invention relates to a flexible composite silicate insulation board material and a preparation method thereof, belonging to the technical field of insulation materials. Background technique [0002] my country's economy has grown rapidly, and various constructions have made great achievements, but it has also paid a huge amount of energy consumption. In energy consumption, heat loss accounts for a considerable proportion. Therefore, thermal insulation materials have developed rapidly in recent years, and their demand in chemical, petroleum, electric power, metallurgy, transportation, national defense, construction and other industries is increasing. Thermal insulation materials can be generally divided into organic thermal insulation materials and inorganic thermal insulation materials according to their composition. Although organic thermal insulation materials such as polystyrene and polyurethane have low thermal conductivity, they are easy to bu...

AI Technical Summary

Problems solved by technology

However, these traditional silicate thermal insulation materials are prone to convective heat dissipation due to the unsealed internal space of the molding material, resulting in unsatisfactory thermal insulation effects, and also have defects such as short service life, easy cracking, and great harm to the human body.