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Thermosetting resin, thermosetting resin composition containing same, cured product, prepreg, laminate, and printed circuit board

A technology of thermosetting and resin, applied in the field of thermosetting resin and thermosetting resin composition, can solve the problems of hygroscopicity, unsatisfactory electrical properties, high cost of bismaleimide resin, poor flame retardancy of epoxy resin, etc., to achieve Low water absorption, excellent heat resistance, and good electrical properties

Inactive Publication Date: 2017-11-21
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many deficiencies in these thermosetting resins: as phenolic resins will produce volatile by-products in the curing reaction, the flame retardancy of epoxy resins is poor, and the cost of bismaleimide resins is higher.
However, due to the presence of free OH groups in this benzoxazine product, it is not very ideal in terms of hygroscopicity and electrical properties.

Method used

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  • Thermosetting resin, thermosetting resin composition containing same, cured product, prepreg, laminate, and printed circuit board
  • Thermosetting resin, thermosetting resin composition containing same, cured product, prepreg, laminate, and printed circuit board
  • Thermosetting resin, thermosetting resin composition containing same, cured product, prepreg, laminate, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] (1) Preparation of benzoxazine resin

[0067] 26.21 g of the mixture of multifunctional phenolic compounds represented by formula (I) and (II) represented by formula (I) and (II) in input mass ratio in chloroform is totally 26.21 g, and mass ratio is represented by formula (a) and (b) of 1 / 1 30.13 g of a mixture of diamine compounds and 8.05 g (0.25 mol) of paraformaldehyde (manufactured by Wako Pure Chemical Industries, Ltd., 94%) were reacted under reflux for 6 hours while removing generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 50.78 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 20500.

[0068] (2) Preparation of cured product

[0069] The polymer obtained in step (1) was kept at 220°...

Embodiment 2

[0071] (1) Preparation of benzoxazine resin

[0072]21.5 g of the mixture of polyfunctional phenolic compounds represented by formulas (I) and (II) represented by formula (I) and (II) are dropped in chloroform, and mass ratio is 2 / 1 represented by formulas (a) and (b) 66.68 g of a mixture of diamine compounds and 7.36 g (0.22 mol) of paraformaldehyde (manufactured by Wako Pure Chemical Industries, Ltd., 94%) were reacted under reflux for 6 hours while removing generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 91.10 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 16600.

[0073] (2) Preparation of cured product

[0074] The polymer obtained in step (1) was kept at 220° C. for 3 hours by hot pressing...

Embodiment 3

[0076] (1) Preparation of benzoxazine resin

[0077] 16.12 g of the mixture of multifunctional phenolic compounds represented by formula (I) and (II) in chloroform, 49.77 g of diamine compounds represented by formula (a), paraformaldehyde (manufactured by Wako Pure Chemical Industries, 94%) 10.64 g (0.32 mol), and reacted under reflux for 6 hours while removing the generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 62.32 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 17800.

[0078] (2) Preparation of cured product

[0079] The polymer obtained in step (1) was kept at 220° C. for 3 hours by hot pressing method to obtain a sheet-shaped cured product with a thickness of 0.5 mm. The obtained cured bo...

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Abstract

The invention provides a thermosetting resin having a dihydrobenzoxazine ring structure, a thermosetting resin composition containing the same, a cured product, a prepreg, a laminate and a printed circuit board. The thermosetting resin with dihydrobenzoxazine ring structure is mainly composed of the polyfunctional phenolic compounds represented by the general formula (I) and / or (II), which are represented by the general formula (a) and / or (b). The diamines shown are prepared by the reaction of the diamines and aldehydes (c). The invention adopts two different polyfunctional phenolic compounds and diamine compounds to synthesize a thermosetting resin with a dihydrobenzoxazine ring structure, effectively synthesizes the advantages of the two monomers, overcomes their respective shortcomings, and obtains The benzoxazine resin also has excellent comprehensive properties such as low dielectric properties, high heat resistance, high toughness and low water absorption.

Description

technical field [0001] The present invention relates to a thermosetting resin, a thermosetting resin composition containing it, a cured product, a prepreg, a laminate and a printed circuit board. Background technique [0002] The rapid development of electronic information technology and consumer electronics has put forward new requirements for multi-functional integrated circuits - reducing their feature size and higher integration. This demand must have stricter requirements for electronic packaging materials: Such as the development of raw material resins with lower dielectric constant and low dielectric loss. [0003] Thermosetting resins such as epoxy resins, phenolic resins, bismaleimide resins, and unsaturated polyester resins have a series of advantages such as excellent water resistance, chemical resistance, heat resistance, and mechanical strength, so they are widely used in electronic materials. has been widely applied. However, these thermosetting resins have m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/06C08L79/04C08J5/24B32B27/28H05K1/02
CPCB32B27/28C08J5/24C08G73/06C08L79/04H05K1/02
Inventor 周应先何岳山许永静
Owner GUANGDONG SHENGYI SCI TECH