Thermal-expansion strippable pressure-sensitive adhesive sheet and coater

Abstract

The invention relates to a thermal-expansion strippable pressure-sensitive adhesive sheet and a coater, and belongs to the technical field of manufacturing of electronic components. The thermal-expansion strippable pressure-sensitive adhesive sheet comprises an adhesive layer and a foamed layer which are coated on a PET film substrate, the adhesive layer comprises, by weight, 50-100 parts of polyurethane resin, 1-30 parts of a polyisocyanate cross-linking agent and 10-50 parts of ethyl acetate and is dried at 60-120DEG C, and the thickness of the dried adhesive layer is 10-30[mu]m; and the foamed layer comprises, by weight, 50-100 parts of polybutyl methacrylate or polymethyl methacrylate, 100-500 parts of organic ultrafine powder, 10-20 parts of dicapryl phthalate, 100-500 parts of ethyl acetate and 10-50 parts of expanded microspheres, the adhesive layer is coated with the foamed layer, the foamed layer is dried at 40-80DEG C, and the thickness of the dried foamed layer is 20-30[mu]m. The adhesive layer and the foamed layer become dry adhesives from non-setting adhesives, so the problems of adhesion, offset cutting and deformation of chips are solved. The coater has the advantages of flattened and uniform coating, uniform drying, and consistent thickness.

Description

technical field [0001] The invention relates to the technical field of electronic component manufacturing, in particular to a heat-expandable peelable pressure-sensitive adhesive sheet and a coating machine for producing chip electronic components. Background technique [0002] In recent years, there are more and more varieties of electronic products, with increasingly powerful functions and smaller and smaller volumes. This requires that the main electronic components in the manufacture of electronic products, such as capacitors, resistors, inductors, sensors, etc., should be as small as possible and as reliable as possible. At present, only chip ceramic electronic components can meet the above requirements at the same time. Ceramic electronic components are calcined at a high temperature above 1000°C, and their insulation, heat resistance, durability and other aspects all show excellent performance. As a result, the manufacture, sale and use of chip ceramic electronic com...

AI Technical Summary

Problems solved by technology

[0017] The above-mentioned imported production line is just the opposite, with high automatic operation efficiency and high alignment accuracy. Disadvantages: First, the separation of the polyester film and the block made of multiple ceramic diaphragms, and the pasting of the existing pressure-sensitive adhesive sheet , the green body of electronic components may be deformed; the second is that the adhesive on the surface of the pressure-sensitive adhesive sheet in the prior art is self-adhesive, that is, sticky at room temperature and soft in texture, so cutting chips When cutting, the soft substrate under the chip will easily weaken the supporting force of the chip on the side that has been cut. When cutting, the chip will move slightly to the side that has been cut, resulting in increased possibility of cutting deviation and deformation.

The above-mentioned three patents still use self-adhesive pressure-sensitive adhesive sheets, and the analysis and trial of related products produced by Japanese and domestic enterprises have not yet solved the above-mentioned problems

Images