A kind of preparation method of high square resistance doped crystalline silicon layer for crystalline silicon-based solar cell
A technology for solar cells and crystalline silicon, applied in the field of solar cells, can solve the problems of difficulty in promotion, high technical difficulty and cost of preparation technology, and achieve the effect of improving conversion efficiency
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Embodiment 1
[0015] Taking the p-type polysilicon substrate as an example, the present invention will be further described by describing specific implementation cases in combination with the content of the present invention, but the scope of protection of the present invention should not be limited by this.
[0016] After the p-type polycrystalline silicon wafer of 156mm*156mm is cleaned by conventional texturing, the solar cell is prepared according to the following process route:
[0017] 1) PECVD deposits a layer with a thickness of 100nm and a doping concentration of 5*10 18 cm -3 Phosphorus-doped amorphous silicon thin film
[0018] 2) The silicon wafer after the deposition of the diffusion source is subjected to Ar / O with an oxygen content of 20% in a roller continuous diffusion furnace. 2 Mixed gas protection atmosphere heat treatment, set the T-t relationship as, 2min rise to 850°C, keep warm for 30min, then drop to 100°C for 5min and take out.
[0019] 3) HF removes the oxide l...
Embodiment 2
[0022] Taking the p-type monocrystalline silicon wafer substrate as an example, the present invention will be further described by describing specific implementation cases in combination with the content of the present invention, but the scope of protection of the present invention should not be limited by this.
[0023] After the p-type monocrystalline silicon wafer of 156mm*156mm is cleaned by conventional texturing, the solar cell is prepared according to the following process route:
[0024] 1) PECVD deposits a layer with a thickness of 100nm and a doping concentration of 2*10 19 cm -3 Phosphorus-doped amorphous silicon thin film; then PECVD method is used to deposit a layer with a thickness of 100nm and a doping concentration of 5*10 19 cm -3 boron-doped amorphous silicon thin film
[0025] 2) The silicon wafer after the deposition of the diffusion source is heat-treated in a roller-type continuous diffusion furnace in a clean air atmosphere. The T-t relationship is se...
Embodiment 3
[0029] Taking the n-type monocrystalline silicon substrate as an example, the present invention will be further described by describing specific implementation cases in combination with the content of the present invention, but this should not limit the protection scope of the present invention.
[0030] After the n-type monocrystalline silicon wafer of 125mm*125mm is cleaned by conventional texturing, the solar cell is prepared according to the following process route:
[0031] 1) PECVD deposits a layer with a thickness of 150nm and a doping concentration of 1*10 20 cm -3 Boron-doped amorphous silicon thin film; then PECVD method is used to deposit a layer with a thickness of 100nm and a doping concentration of 5*10 19 cm -3 Phosphorus-doped amorphous silicon thin film
[0032] 2) The silicon wafer after deposition of the diffusion source is heat treated in a clean air atmosphere in a roller continuous diffusion furnace. The T-t relationship is set as 2min to 900°C, heat p...
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Abstract
Description
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