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Adhesive barrier film construction

A barrier film and barrier layer technology, applied in adhesives, bonding methods, nonlinear optics, etc., can solve problems such as luminous loss, poor interlayer adhesion, and oxidative damage

Active Publication Date: 2016-03-23
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0001] Certain materials used to make light-emitting devices, such as organic light-emitting diodes (OLEDs) and quantum dots, suffer oxidative damage when exposed to air and moisture, often resulting in loss of light emission
While barrier layers are known to be effective at preventing air and moisture penetration, attempts to bond such barrier layers to convenient polymeric matrices containing sensitive materials have resulted in poor interlayer adhesion

Method used

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Examples

Experimental program
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Effect test

example 1

[0052] Barrier films were prepared as follows on a vacuum coater similar to the coaters described in US Pat. Nos. 5,440,446 (Shaw et al.) and 7,018,713 (Padiyath et al.). A coating precursor solution of tricyclodecane dimethanol diacrylate (SR833S, Sartomer) was evaporated and spread to a 2 mil (50 micron) thick, 14 inch ( 36cm) wide PET substrate, made 12.5 inches (32cm) wide coating. The substrate acrylate layer was coated at a constant line speed of 16 fpm (5 m / min). The coating was then cured immediately downstream using an electron beam operating at 7.0 kV and 4.0 mA. The flow rate of liquid into the evaporator was 1.33 ml / min, the flow rate of gas was 60 sccm and the temperature of the evaporator was 260°C. The processing drum temperature was 0°C. Immediately after the curing treatment was a subsequent reactive AC sputtering treatment at 5 kW power to set up a 30 nm silicon alumina coating. The third in-line process provided a second (top) acrylate layer to the first...

example 2

[0072] Barrier films were constructed in a manner similar to that described in Example 1. About 2 mils (50 microns) of hot melt ethylene vinyl acetate (EVA) adhesive was then coated onto the barrier film. Adhesion was tested by attaching the PET substrate used in Example 1 to an EVA adhesive layer, and then tested according to ASTMD1876-08 "Standard Test Method for Peel Resistance of Adhesives (T-Peel Test)" (StandardTestMethodforPeelResistanceofAdhesives( T-PeelTest)) to test the peel strength. It was observed during the coating process that for electron beam cured acrylates, all doses considered to be applied had lower adhesion. Good adhesion (peel strength greater than about 200 g / in) was observed for the barrier film UV cured using the UV light source of Example 1 with a high output at 254 nm and a minimum output below 220 nm and using an exposure time of 0.1 seconds - 0.5 seconds.

[0073] The following is a list of examples of the present disclosure.

[0074] Item 1 i...

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Abstract

The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.

Description

Background technique [0001] Certain materials used to fabricate light-emitting devices, such as organic light-emitting diodes (OLEDs) and quantum dots, suffer oxidative damage when exposed to air and moisture, often resulting in loss of light emission. While preparing barrier layers is known to be effective at preventing air and moisture penetration, attempts to bond such barrier layers to convenient polymeric substrates containing sensitive materials have resulted in poor interlayer adhesion. Contents of the invention [0002] The present disclosure is directed to forming a bond with high peel resistance between an adhesive layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of devices, particularly light emitting devices, the present disclosure describes methods of assembling light emitting devices. The light emitting device includes an encapsulation system using a flexible transparent barrier film and an ultraviolet (UV) radiatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04H01L51/52H05B33/04C08J7/043C08J7/048H10K99/00
CPCC08J2367/02C08J2433/08C09J5/00C08J7/0423C09J2301/416C08J7/048C08J7/043H10K59/8731G02F1/133614H10K50/8445H10K50/85H10K50/115H10K50/8426H10K59/12H10K71/00H10K85/40H10K85/141H10K59/1201G02F1/1336
Inventor 约瑟夫·M·彼佩尔埃里克·W·纳尔逊弗雷德·B·麦考密克卡里萨·L·埃克特亚当·M·内布拉斯卡
Owner 3M INNOVATIVE PROPERTIES CO
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