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Laser ablation processing method for quartz crystal

A quartz crystal and laser etching technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as poor dimensional accuracy, difficulty in productization, and easy breakage, to achieve neat and accurate edges, and eliminate negative Influence, the effect of weakening the negative influence

Active Publication Date: 2016-04-27
BEIJING INST OF RADIO METROLOGY & MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For high-frequency quartz crystal slices, when using physical grinding technology to process quartz crystal slices, generally only the whole piece of grinding can be used. The thickness of the crystal slice can only reach about 40μm, and the frequency is about 40MHz. If the frequency is higher, the thickness of the crystal slice will be too high. Thin, easy to break during processing; when using chemical corrosion process to process quartz crystal sheet, if the crystal sheet is thinned as a whole, the frequency can only reach about 80MHz, and the thickness of the crystal sheet is about 20μm. If the frequency is higher, the crystal sheet The thickness will be so thin that it is difficult to meet the mechanical strength requirements; the quartz crystal sheet is partially chemically etched and thinned by coating a protective mask. Due to the small size of the crystal sheet, there are problems that the process is difficult and the accuracy is difficult to guarantee; Local thinning of the crystal sheet has the problems of large investment, complex process, long cycle, and difficult frequency control, making it difficult to realize productization
[0004] For special-shaped quartz crystal sheets, physical grinding cannot be realized; chemical etching or ion etching is used, the process is very complicated, the processing is very difficult, the surface protection is difficult to complete, the corroded cross-section is rough, the dimensional accuracy is poor, and the performance and reliability are low. , and the cost is high and the cycle is long

Method used

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  • Laser ablation processing method for quartz crystal
  • Laser ablation processing method for quartz crystal
  • Laser ablation processing method for quartz crystal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Using a laser to locally thin a quartz crystal sheet with a size of 5.00mm×2.55mm×0.100mm and a surface roughness of 200nm, the following is obtained: figure 2 The shown groove bottom wall of 2.500mm×1.800mm×0.006mm includes the following steps:

[0054] Prepare the laser:

[0055] Choose lasers that can excite short pulse lasers with a pulse width of 5ps to 20ps;

[0056] The laser pulse repetition frequency is selected as 160kHz, and the output power of the laser is selected as 800mW;

[0057] The control mode of the laser is selected as the windows (software trigger) control mode, and the control right of the laser gate is handed over to the laser processing control software;

[0058] Prepare control software:

[0059] Start the laser processing control software;

[0060] Laser focus correction, search and correction of laser focus, so that the focus of the laser and the focus of the observation lens are at the same height;

[0061] The lens is aligned, and the...

Embodiment 2

[0085] Use laser to realize such as image 3 The tuning fork shown contains a slot of 3.000mm x 0.200mm x 0.200mm. Include the following steps:

[0086] Prepare the laser:

[0087] Select the laser, the laser can excite the laser with a pulse width of 5ps ~ 20ps;

[0088] The pulse repetition frequency is 200kHz, and the output power of the laser is selected as 900mW;

[0089] The control mode of the laser is selected as windows (software trigger) control mode;

[0090] Prepare control software:

[0091] Start the laser processing control software;

[0092] Laser focus correction, search and correction of laser focus, so that the focus of the laser and the focus of the observation lens are at the same height;

[0093] The lens is aligned, and the focus of the observation lens and the focus of the focusing galvanometer are compensated in the horizontal direction, so that the center of the focusing galvanometer coincides with the center of the field of view of the observat...

Embodiment 3

[0117] Example 1 was repeated, except that the pulse repetition frequency was 50 kHz, the output power of the laser was 300 mW, and the scanning speed of the laser beam was 50 mm / s.

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Abstract

The invention discloses a laser ablation processing method for quartz crystal. The laser ablation processing method specifically comprises the steps of selecting lasers, preparing control software, designing processing drawings, carrying out laser ablation, carrying out post-processing treatment and carrying out detection. The method for processing the quartz crystal is designed on the basis of limitation to the condition of each step, the quartz crystal can be effectively processed for forming various shapes and can be thinned through the processing method, the thickness of the thinned quartz crystal is small, the corresponding base frequency is high, and the strength of the processed quartz crystal is high. In addition, the processing method is simple, the processing accuracy is high, and the processing dimensional accuracy of the quartz crystal can be controlled to be within the range of + / - 5 micrometers.

Description

technical field [0001] The invention relates to the field of quartz crystal processing. More specifically, it relates to a laser etching processing method for quartz crystal. Background technique [0002] Quartz crystal materials, especially α-quartz, can be made into components such as quartz crystal resonators, quartz crystal oscillators, and quartz crystal filters because of their piezoelectric effect characteristics, and are widely used in electronic products. With the development of high-frequency and functional electronic products, the processing requirements for high fundamental frequency crystal slices and special-shaped crystal slices are becoming more and more urgent. The hardness of quartz crystal is Mohs hardness 7, high hardness, brittle and easy to break, it is a typical hard and brittle material. Different from isotropic quartz glass (also known as: fused silica) material, quartz crystal has anisotropy, thermal expansion coefficient, thermal conductivity, el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/0622B23K26/046B23K26/402B23K26/70
CPCB23K26/046
Inventor 王作羽叶林周伟平郑文强崔巍睢建平段友峰刘小光牛磊
Owner BEIJING INST OF RADIO METROLOGY & MEASUREMENT
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