Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photocurable and thermocurable resin composition and dry film solder resist

A thermosetting resin, light curing technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problems of thermal conductivity and electromagnetic absorption performance difficulties, reduce thermal conductivity and other problems, and achieve excellent thermal conductivity and electromagnetic wave absorbing properties, reducing the withstand voltage strength, maintaining the effects of magnetic and thermal conductivity

Active Publication Date: 2016-05-04
LG CHEM LTD
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, a product in which a sheet having heat conduction properties and a sheet having electromagnetic wave shielding / absorbing properties is stacked has been widely used, but due to the nature of the multilayer material, the product is thick and has problems such as generation of an electrical short circuit, and Difficulties in making thermal conductivity and electromagnetic absorption properties to the extent required for electronic devices in recent years
In addition, in order to improve thermal conductivity and electromagnetic absorption performance, a method of increasing the charge amount of the filler added to the multilayer material has been proposed, however, it is difficult to charge the filler beyond a certain amount due to compatibility etc., and when the filler When the charging capacity increases, the hardness of the multilayer material increases, thereby reducing the thermal conductivity of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photocurable and thermocurable resin composition and dry film solder resist
  • Photocurable and thermocurable resin composition and dry film solder resist
  • Photocurable and thermocurable resin composition and dry film solder resist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment and

[0215] [Examples and Comparative Examples: Preparation of Resin Composition, Dry Film, and Printed Circuit Board]

Embodiment 1 to 3

[0217] A bisphenol-based cyanate compound (BA-230) from Lonza was used as the iminocarbonate-based compound of the acid-modified oligomer, and then contained in the bisphenol-based cyanate compound (BA-230) Cyanate groups were reacted with acrylic acid and 1,2,3,6-tetrahydrophthalic acid (4-cyclohexene-1,2-dicarboxylic acid) in a molar ratio of 1:1 to prepare the An aminocarbonate compound which is an acid-modified oligomer.

[0218] Using 45 g of this imino carbonate-based compound, it was mixed with 15 g of ZAR-2000 purchased from NipponKayaku, Co., Ltd. as another acid-modified oligomer, 10 g of ZAR-2000 purchased from SK Cytec Co., Ltd. as a photopolymerizable DPHA of monomer, 2.5g of TPO as photoinitiator, 15g of YDCN-500-80P as thermosetting adhesive purchased from NipponKayaku, Co., Ltd., 0.25g of 2 as thermosetting adhesive catalyst - PI and the inorganic filler described in Table 1 below, 0.3 g of phthalocyanine blue as a pigment, 3.5 g of BYK-110 as a dispersant, an...

experiment Embodiment 1

[0234] Experimental Example 1: Developability (sensitivity) evaluation

[0235] A 12 μm copper foil laminate purchased from Mitsui Mining & Smelting Co., Ltd. was cut into a size of 5 cm × 5 cm, and a good roughness was formed on the surface of the copper foil by chemical etching. After the release film was removed from each dry film prepared in the above examples and comparative examples, the film layer was vacuum laminated with a vacuum laminator (MVLP-500, Meiki Co., Ltd.) to form roughness copper foil laminate (substrate).

[0236] Then, a negative photomask having a hole shape with a diameter of 80 μm was closely adhered thereto, followed by exposing it to UV in a wavelength range of 365 nm at an exposure amount of 350 mJ / cm 2 . Thereafter, the PET film was removed and replaced with 1 wt% Na 2 CO 3 The alkaline solution was developed at 31° C. for a certain period of time, thereby forming a pattern.

[0237] Then, the shape of the pattern formed above was observed ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority from Korean Patent Application No. 10-2014-0147657 filed in the Korean Intellectual Property Office on Oct. 28, 2014, the entire contents of which are hereby incorporated by reference into this specification. technical field [0003] The present invention relates to a photocurable and thermally curable resin composition and a dry film type solder resist. Background technique [0004] With the miniaturization and weight reduction of various electronic devices, photosensitive solder resists capable of forming minute opening patterns have been used in printed circuit boards, semiconductor packaging substrates, flexible circuit boards, and the like. [0005] Semiconductor packaging products are composite materials composed of insulators such as epoxy resin moldings and solder resists, semiconductors such as chips, and conductors such as circuit board patterns, and in order t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/038
Inventor 崔炳柱庆有真郑遇载崔宝允李光珠郑珉寿
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com