Conductive foam and fabrication method thereof

A technology of conductive foam and its production method, applied in electrical components, magnetic field/electric field shielding, coating and other directions, can solve problems such as poor adhesion, insufficient viscosity, restricting development, etc., and achieve the effect of eliminating tiny gaps and increasing surface activity

Active Publication Date: 2016-05-04
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Conductive foam pads are widely used due to their advantages of large compressibility, adaptability to various standard configurations, punching into different shapes, and low price. The conductive cloth of the melt adhesive is wrapped with foam and other fillers. Due to the characteristics of the hot melt adhesive and the material itself, it does not have the characteristics of high temperature resistance and tinning, so it cannot be assembled automatically. It needs to be pasted manually during use. , manual work will cause poor adhesion and poor viscosity after the adhesive is placed for a long time, which will affect the product's sticking effect

Method used

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  • Conductive foam and fabrication method thereof
  • Conductive foam and fabrication method thereof

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Embodiment 1

[0024] An embodiment of the present invention provides a conductive foam, such as figure 1 As shown, it includes: an elastic body 10 arranged sequentially from the inside to the outside, an adhesive layer 20 wrapped on the outer surface of the elastic body 10, and a shielding layer 30. The shielding layer 30 is provided with a polymer film 301 and a metal The layer 302 is provided with a treatment agent layer 40 for increasing the surface activity of the high molecular polymer film between the high molecular polymer film 301 and the adhesive layer 20 .

[0025] Among them, the high molecular polymer film can adopt polyimide film to make it have better high temperature resistance effect, and the metal layer can adopt copper plating layer and nickel plating layer plated on the polyimide film in sequence from bottom to top, so that It can have a better conductive shielding effect and has a strong anti-corrosion function.

[0026] In order to further ensure the structural stabili...

Embodiment 2

[0036] Based on the above-mentioned embodiment 1, the embodiment of the present invention provides a method for manufacturing conductive foam, such as figure 2 shown, including the following steps.

[0037] Step 101: After uniformly coating the treatment agent on the inner surface of the polymer film of the shielding layer to form a treatment agent layer, put it into a constant temperature oven and bake for 10 to 20 minutes, preferably 15 minutes. The temperature range of the constant temperature oven is Set at 90-110°C. The optimal setting temperature of the constant temperature oven is 100°C. In this case, the treatment agent and the high molecular polymer film are fully contacted, and the surface activity of the high molecular polymer film is greatly improved, especially when the high molecular polymer is selected from polyimide film, the effect is better. Here, the treatment agent, material preparation and parameter setting of the shielding layer can all be processed ac...

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Abstract

The invention discloses conductive foam and a fabrication method thereof. The conductive foam comprises an elastic body, a bonding layer and a shielding layer, wherein the bonding layer wraps the outer surface of the elastic body, the elastic body, the bonding layer and the shielding layer are sequentially arranged from inside to outside, the shielding layer is provided with a high-molecular polymer film and a metal layer from inside to outside, and a processing agent layer is arranged between the high-molecular polymer film and the bonding layer and used for improving the surface activity of the high-molecular polymer film. With a mode of additionally arranging the processing agent layer, the surface activity of the high-molecular polymer film is improved, the high-molecular polymer film is more tightly and firmly bonded with the elastic body by the bonding layer, a permeating bonding effect is formed between the bonding layer and the high-molecular polymer film, a tiny gap is eliminated, and the high-molecular polymer film is difficult to pop from the elastic body in a high-temperature environment.

Description

technical field [0001] The invention relates to the technical field of shielding materials, in particular to a conductive foam and a manufacturing method thereof. Background technique [0002] Shielding is the isolation of metal between two spatial regions to control the induction and radiation of electric fields, magnetic fields and electromagnetic waves from one region to another. Specifically, it is to use a shield to surround the interference source of components, circuits, assemblies, cables or the entire system to prevent the interference electromagnetic field from spreading outward; to surround the receiving circuit, equipment or system with a shield to prevent them from being affected by the outside world. The influence of electromagnetic fields. [0003] Commonly used shielding materials include conductive rubber shielding gasket, beryllium copper reed shielding gasket, conductive glue, magnetic field shielding material (commonly known as wave absorbing material), ...

Claims

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Application Information

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IPC IPC(8): H05K9/00C08J7/04C09D7/12C09D183/04C09J11/06C09J11/08C09J183/04
CPCC08J7/0427C08J2379/08C08J2483/04C08L2203/14C08L2205/025C08L2205/03C09D7/63C09D183/04C09J11/06C09J11/08C09J183/04H05K9/0081C08L1/02C08L83/04
Inventor 窦兰月
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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