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Two-component structural adhesive and preparation method thereof

A structural adhesive, two-component technology, applied in the direction of adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems of hard disk drives not operating normally, structural adhesive ratio imbalance, and affecting bonding performance. Achieve the effects of long pot life, low curing temperature, and prevention of proportional imbalance

Active Publication Date: 2020-03-06
NANJING NUOBANG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional one-component epoxy resin structural adhesives use solid aliphatic amine polyamines and have a wide particle size distribution, most of which are larger than 2 micron particles. This causes large particles of solid curing agents to fail to penetrate into the parts that need to be fixed during the dispensing process. In the slit, the proportion of structural adhesive is out of balance, which seriously affects the bonding performance and makes the hard disk drive unable to operate normally

Method used

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  • Two-component structural adhesive and preparation method thereof
  • Two-component structural adhesive and preparation method thereof
  • Two-component structural adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0052] A kind of two-component structural glue, its raw material components include by mass percentage:

[0053] Component A, the mass percentage of component A is based on 100%, including:

[0054] 40% epoxy resin, 30% toughening agent, 25% diluent, 1% crosslinking agent, 4% reinforcing filler;

[0055]Component B, the mass percentage of component B is based on 100%, including:

[0056] Aliphatic amine polyamine 20%, epoxy resin-aliphatic amine copolymer 40%, toughening agent 20%, triamine accelerator 10%, reinforcing filler 10%;

[0057] The mass ratio of component A to component B is 1:1. Among them, the epoxy resin adopts the epoxy resin whose epoxy equivalent is 200-210g / eq, and the viscosity at 25°C is 1600-2000cps, and the epoxy resin whose epoxy equivalent is 325-375g / eq, and the viscosity at 25°C is 3000-8000cps A mixture of elastomer-modified epoxy resins, aliphatic amine polyamines with an active hydrogen equivalent of 42.6g / eq, isophorone diamine with a viscosit...

Embodiment 2

[0064] A kind of two-component structural glue, its raw material components include by weight parts:

[0065] A kind of two-component structural glue, its raw material components include by mass percentage:

[0066] Component A, the mass percentage of component A is based on 100%, including:

[0067] 50% epoxy resin, 25% toughening agent, 20% diluent, 2% crosslinking agent, 3% reinforcing filler;

[0068] Component B, the mass percentage of component B is based on 100%, including:

[0069] Aliphatic amine polyamine 50%, epoxy resin-aliphatic amine copolymer 20%, toughening agent 20%, triamine accelerator 5%, reinforcing filler 5%; the mass ratio of component A to component B It is 4:1. Among them, the epoxy resin adopts epoxy resin with epoxy equivalent of 182-192g / eq, viscosity at 25°C of 11000-15000cps, epoxy equivalent of 220-240g / eq, viscosity at 25°C of 2000-4000cps The mixture of polyurethane modified epoxy resin and epoxy equivalent of 275-305g / eq, viscosity of 4000...

Embodiment 3

[0077] A kind of two-component structural glue, its raw material components include by mass percentage:

[0078] Component A, the mass percentage of component A is based on 100%, including:

[0079] 90% epoxy resin, 5% toughening agent, 3% diluent, 1% crosslinking agent, 1% reinforcing filler;

[0080] Component B, the mass percentage of component B is based on 100%, including:

[0081] Aliphatic amine polyamine 60%, epoxy resin-aliphatic amine copolymer 10%, toughening agent 10%, triamine accelerator 10%, reinforcing filler 10%; the mass ratio of component A to component B It is 10:1.

[0082] Among them, the epoxy resin adopts the epoxy equivalent of 232-254g / eq, the viscosity at 25°C is 6000-8000cps core-shell rubber modified epoxy resin and the epoxy equivalent is 285-310g / eq, and the viscosity at 50°C is 16000-20000cps core-shell rubber-modified epoxy resin mixture, the aliphatic amine polyamine adopts polyetheramine with an active hydrogen equivalent of 60g / eq, a visc...

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Abstract

The invention discloses a double-component structural adhesive and a preparation method thereof. The double-component structural adhesive is composed of a component A and a component B. The component A comprises the following constituents in percentage by mass: 40-90% of epoxy resin, 5-35% of toughener, 3-25% of diluter, 0.1-3% of crosslinking agent and 1-10% of reinforcing filler, totaling 100%. The component B comprises the following constituents in percentage by mass: 20-60% of fatty amine polyamine, 10-40% of epoxy resin-fatty amine copolymer, 5-20% of toughener, 1-10% of tertiary amine accelerator and 3-15% of reinforcing filler, totalling 100%. The mass ratio of the component A to the component B is (1-10):1. The double-component structural adhesive has high binding strength, can be effectively filled in the slit, effectively prevents the problems of disproportionality and incomplete curing, has the advantages of low curing temperature, long working life, simple technique and high stability, and is convenient for transportation.

Description

technical field [0001] The patent of the present invention relates to the technical field of polymer material application, in particular to a two-component structural adhesive and its preparation method. Background technique [0002] With the continuous development of the precision machinery industry, various new types of precision equipment continue to emerge, the driving force of which mainly comes from the application in the automotive industry and consumer electronics industry, such as new energy vehicles, hard disk drives, notebook computers, tablet computers, smart phones Waiting for frequent innovations. The functions of these devices are becoming more and more powerful, the computing speed is getting faster and faster, and the size is getting smaller and smaller, which leads to the development of the assembly process in the direction of miniaturization. Therefore, how to effectively bond these precision components during the assembly process to meet the needs of hig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04
CPCC08L2207/53C09J11/04C09J11/08C09J163/00C08L13/00C08K3/36C08L51/04
Inventor 刘兵刘勇
Owner NANJING NUOBANG NEW MATERIAL CO LTD
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