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A kind of copper precipitation pretreatment liquid and pretreatment method thereof

A pretreatment liquid and copper sinking technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as weak adhesion, increased cost burden, copper plating quality limitation, etc., to improve backlight Effect, improvement of peel strength, effect of enhanced viscosity strength

Active Publication Date: 2022-06-17
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] CN200510008522 adjusts the concentration of the surface finishing agent by using alkyltrialkoxysilane surface-treated bentonite, so that the dispersion stability of the surface regulator is excellent, but the adhesion between the substrate and the coating after the regulator is treated The force is weak, which is affected by various components in the copper deposition process, and the quality of copper plating is limited by the base material; at the same time, the current horizontal copper deposition process has poor backlight effect of the plated parts due to the use of concentrated activators. Moreover, it also increases the cost burden, and at the same time, the copper deposition rate is unstable in the electroless copper deposition process, and it is difficult to maintain a balance
CN201811619234 adopts purified water, phosphopeptide mixture, phosphate, polyoxyethylene ether, alkaline reagent and surfactant to provide a kind of liquid surface regulator, which has good storage stability and promotes the formation of phosphating film coating, but its The resulting coating is poorly lit

Method used

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  • A kind of copper precipitation pretreatment liquid and pretreatment method thereof
  • A kind of copper precipitation pretreatment liquid and pretreatment method thereof
  • A kind of copper precipitation pretreatment liquid and pretreatment method thereof

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Experimental program
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Embodiment 1-16

[0050] Embodiments 1-16 of the present invention provide a pretreatment solution for copper precipitation, the components of which are as follows.

[0051] Among them, the resin substrate 1 represents the roughness Ra: 590-630nm, purchased from Shengyi Technology, the model is S1000-M.

[0052] Resin base 2 indicates roughness Ra: 480-500nm, purchased from Shengyi Technology, model S1150G.

[0053] Resin matrix 3 represents epoxy resin substrate, roughness Ra: 900 to 1000 nm, purchased from Shengyi Technology, model S1141.

[0054] Nitrogen-containing non-quaternary amine compound A: 2-hydrazine pyridine (from Shanghai McLean Biochemical Technology Co., Ltd., product number: H831435, CAS number: 4930-98-7)

[0055] Nitrogen-containing non-quaternary amine compound B: 4-imidazole acrylic acid (from Shanghai McLean Biochemical Technology Co., Ltd., product number: U833629, CAS number: 104-98-3)

[0056] Cationic polymer C: copolymer containing pyridine six-membered heterocycle...

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Abstract

The invention relates to the field of electroless plating on a non-conductive substrate, and more specifically, the invention relates to a copper deposition pretreatment solution and a pretreatment method thereof. The pre-treatment solution for copper precipitation includes 0.01-100g / L cationic polymer; Aminated and cationic polymers. After using the copper pretreatment solution of this application, the copper growth state in the hole is good, there is no copper nodules, the quality of the coating is high, the adhesion between the coating and the resin substrate is excellent, and the backlight level reaches above 9, even 10 grades.

Description

technical field [0001] The present invention relates to the field of electroless plating on non-conductive substrates, in particular, the present invention relates to C23C22 / 78. Background technique [0002] CN200510008522 The concentration of surface finishing agent is adjusted by using bentonite surface-treated with alkyltrialkoxysilane, so that the dispersion stability of the surface conditioning agent is excellent, but the adhesion between the substrate and the plating layer treated by the conditioning agent The force is weak, which is affected by the components in the copper immersion process, and the quality of copper plating is limited by the base material; at the same time, the current horizontal copper immersion process has poor backlighting effect due to the use of concentrated activators. It also increases the cost burden, and at the same time, the copper deposition rate is unstable in the electroless copper deposition process, and it is difficult to maintain a ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18
CPCC23C18/1834
Inventor 孙宇曦曾庆明
Owner 广东硕成科技股份有限公司
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