Multilayer chip varistor and preparation method thereof

Abstract

The invention discloses a multilayer chip varistor and a preparation method thereof. The preparation method includes: preparing pressure-sensitive diaphragms; laminating copper foils to the pressure-sensitive diaphragms, etching, and sequentially overlaying the pressure-sensitive diaphragms and the pressure-sensitive diaphragms with the copper foils to form a blank; compacting and cutting the blank to form a formed sample; sintering the formed sample to form a multilayer chip varistor ceramic body; coating sliver electrodes at the two ends of the multilayer chip varistor ceramic body, and performing thermal treatment to form the multilayer chip varistor. The multilayer chip varistor is obtained according to the preparation method. The multilayer chip varistor and the preparation method thereof have the advantage that utilization reliability of products is improved on the basis of reduction of preparation cost of the varistor.

Description

technical field [0001] The invention relates to the field of manufacturing electronic components, in particular to a multilayer chip piezoresistor and a preparation method thereof. Background technique [0002] Zinc oxide varistors are widely used in household appliances and other electronic products due to their advantages such as large flow density, strong voltage limiting ability, fast response speed, wide application voltage, and high energy absorption capacity. It plays the role of overvoltage protection, lightning protection, suppression of surge current, and noise elimination. [0003] Multilayer chip zinc oxide varistors, because of their small size and easy automatic placement, meet people's requirements for thinner and thinner electrical and electronic products and production processes, so they are more and more valued by people. and favored. [0004] At present, the internal electrodes of multilayer chip zinc oxide varistors are mostly made of silver palladium p...

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Problems solved by technology

[0004] At present, the internal electrodes of multilayer chip zinc oxide varistors are mostly made of silver palladium paste or silver paste, because silver (Ag) and palladium (Pd) are precious metals, so silver (Ag) and palladium (Pd) are used as internal electrodes. Electrodes will inevitably increase the production cost of pressure-sensitive products, so those skilled in the art are looking for ways to replace silver (Ag) electrodes and silver-palladium electrodes, and some have begun to study the use of copper (Cu) paste and nickel (Ni) paste to prepare internal electrodes , although this can greatly reduce the manufacturing cost of multilayer chip varistors, but like silver (Ag) ions, copper (Cu) ions and nickel (Ni) ions also migrate and diffuse during the sintering process of the product. It has an adverse effect on the aging performance of the product, and also increases the risk of the product during use

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