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Thermal leveling method for high-density tungsten alloy thin plate

A technology of tungsten alloy and high specific gravity, which is applied in the field of thermal leveling of high specific gravity tungsten alloy sheet, can solve the problems that hinder the practical application of the process, and achieve the effect of reliable performance, wide source of equipment, simple and efficient method

Active Publication Date: 2016-05-25
XIAN REFRA TUNGSTEN & MOLYBDENUM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the high-temperature pressure leveling process, due to the presence of nickel, iron or copper metal elements in the material, the alloying elements are easy to form diffusion bonding during the treatment process, which hinders the practical application of this process.

Method used

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  • Thermal leveling method for high-density tungsten alloy thin plate

Examples

Experimental program
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Effect test

Embodiment 1

[0027] The thermal leveling method of the high specific gravity tungsten alloy thin plate of the present embodiment comprises the following steps:

[0028] Step 1. Cut the high specific gravity tungsten alloy thin plate with a thickness of 1.0mm into a rectangular tungsten alloy thin plate with a rectangular length and width of 200±1mm and 100±1mm respectively; the high specific gravity tungsten alloy thin plate It is 90W7Ni3Fe tungsten alloy sheet;

[0029] Step 2, uniformly heating the tungsten alloy thin plate cut in step 1 to 80°C;

[0030] Step 3, evenly spraying a sodium hydroxide solution with a mass concentration of 5% on the surface of the heated tungsten alloy sheet in step 2, and then drying;

[0031] Step 4, such as figure 1 As shown, the tungsten alloy thin plates 1 after drying in the two steps 3 are stacked on the leveling template 2 with a thickness of 30mm, a surface roughness of 0.02mm, and a smoothness of Ra1.6μm, and then on the uppermost layer of tungste...

Embodiment 2

[0036] The thermal leveling method of the high specific gravity tungsten alloy thin plate of the present embodiment comprises the following steps:

[0037] Step 1. Cut the high specific gravity tungsten alloy thin plate with a thickness of 0.1mm into a circular tungsten alloy thin plate with a diameter of Φ100±1mm; the high specific gravity tungsten alloy thin plate is 97W2NiFe tungsten alloy thin plate;

[0038] Step 2, uniformly heating the tungsten alloy sheet cut in step 1 to 150°C;

[0039] Step 3, evenly spraying a sodium hydroxide solution with a mass concentration of 10% on the surface of the heated tungsten alloy sheet in step 2, and then drying;

[0040] Step 4, such as figure 2 As shown, 10 stacks of tungsten alloy thin plates 1 after drying in step 3 are placed on the leveling template 2 with a thickness of 15mm, a surface roughness of 0.017mm, and a smoothness of Ra0.6μm, and then on the top layer of tungsten Place a pressure leveling template 3 with a thicknes...

Embodiment 3

[0045] The thermal leveling method of the high specific gravity tungsten alloy thin plate of the present embodiment comprises the following steps:

[0046] Step 1. Cut the high specific gravity tungsten alloy thin plate with a thickness of 0.1mm into a rectangular tungsten alloy thin plate with a rectangular length and width of 180±1mm and 120±1mm respectively; the high specific gravity tungsten alloy thin plate It is 90W5Ni5Cu tungsten alloy sheet;

[0047] Step 2, uniformly heating the tungsten alloy sheet cut in step 1 to 100°C;

[0048] Step 3, evenly spraying a potassium hydroxide solution with a mass concentration of 15% on the surface of the heated tungsten alloy sheet in step 2, and then drying;

[0049] Step 4, such as figure 2 As shown, the tungsten alloy thin plates 1 after drying in step 3 of the five steps are stacked on the leveling template 2 with a thickness of 20mm, a surface roughness of 0.015mm, and a smoothness of Ra0.8μm, and then on the uppermost layer...

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Abstract

The invention discloses a thermal leveling method for a high-density tungsten alloy thin plate. The thermal leveling method comprises the following steps: firstly, cutting the high-density tungsten alloy thin plate into tungsten alloy thin plates of same shape and size; secondly, uniformly heating the cut tungsten alloy thin plates; thirdly, spraying an alkali liquid onto the heated tungsten alloy thin plates, and drying; fourthly, stacking the plurality of dried tungsten alloy thin plates on a leveling template, placing a pressing leveling template on the uppermost layer of the tungsten alloy thin plate, and adding a weighing pressure plate on the pressing leveling template , thereby obtaining a leveling module; fifthly, putting the leveling module into a high-temperature furnace, performing annealing treatment in hydrogen, performing furnace cooling, and discharging out of the furnace; sixthly, boiling the discharged tungsten alloy thin plates in a boiled acid liquid, fishing out, washing with clean water, and wiping off the water, so as to obtain the leveled tungsten alloy thin plates. The method disclosed by the invention overcomes the problem of adhesion in high-density tungsten alloy thermal leveling, is applicable to leveling of high-density tungsten alloy plates of various types, is stable and reliable, and can be widely used in production.

Description

technical field [0001] The invention belongs to the technical field of metal material processing, and in particular relates to a thermal leveling method for a high specific gravity tungsten alloy thin plate. Background technique [0002] High specific gravity tungsten alloy is made of tungsten as the base material (the tungsten content is 85% ~ 99%), adding a small amount of nickel (Ni), copper (Cu), iron (Fe), cobalt (Co), molybdenum (Mo), chromium An alloy material composed of a metal binder such as (Cr), also known as a high-density tungsten alloy or a heavy alloy [1]. The more commonly used ones are: W-Ni-Cu and W-Ni-Fe two series. This material has remarkable characteristics in physical properties such as density, strength, hardness, ductility, electrical conductivity / thermality, etc., so it is widely used in defense industry, aerospace industry, medical industry, electrical industry and other industries. [0003] At present, the preparation method of high specific gr...

Claims

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Application Information

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IPC IPC(8): B21D1/00
CPCB21D1/00
Inventor 淡新国李长亮张腾张清赵娟李斌郭磊温亚辉
Owner XIAN REFRA TUNGSTEN & MOLYBDENUM