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Input antenna for rfid, rfid and their manufacturing method

An antenna, resin technology, applied in the direction of radiating element structure and other directions, can solve the problems of adhesion, high ratio, and inability to obtain antenna coil structure, etc., to achieve high bonding strength, suppress deformation, and have the effects of thermal stability

Active Publication Date: 2020-05-22
TOYO ALUMINIUM KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the antenna coil structure of Patent Document 1, since two adhesive layers need to be formed separately, there is a problem of increasing the number of manufacturing steps.
[0008] In addition, in Patent Document 2, since low-heat-resistant vinyl chloride is used as a base material, it is used in the process of etching a circuit pattern, printing (screen printing, offset printing), or forming an antenna coil structure by vapor deposition. In the process of packaging IC chips, the heating temperature range may be limited, or a smooth antenna coil structure may not be obtained due to deformation.
In addition, although vinyl chloride, vinyl acetate, and maleic acid copolymers, which are excellent in low-temperature adhesiveness, are used as thermoplastic adhesives, if the ratio of vinyl acetate in the adhesive becomes high, the When the surfaces of the adhesive of the antenna coil structure are overlapped and stored, there is a problem of blocking (brocking)

Method used

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  • Input antenna for rfid, rfid and their manufacturing method
  • Input antenna for rfid, rfid and their manufacturing method
  • Input antenna for rfid, rfid and their manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Ethylene-vinyl acetate copolymer resin (manufactured by Nippon Polyurethane Co., Ltd., Novatec (ノバテック)) and polyurethane adhesive (manufactured by DIC Corporation, 100 parts of LX500, and 10 parts of KW75 as a hardener) were mixed with ethyl acetate The adhesive obtained by ester dilution / mixing was applied to one side of an aluminum foil made by Toyo Aluminum Co., Ltd. with a thickness of 30 μm, and the thickness after the solvent was evaporated was 3 μm. The mixing ratio is adjusted so that the content of the ethylene-vinyl acetate copolymer resin in the adhesive layer after the solvent has been volatilized is A mass %, and when the content of the polyurethane resin is B mass %, it becomes ( A / B) = 2.5 relationship.

[0068] In addition, (A+B)=70 at this time.

[0069] After that, a PET film with a thickness of 38 μm manufactured by Teijin DuPont Film Co., Ltd. (Teijin DuPont Film Co., Ltd.) was pasted on the surface of the adhesive layer, and then cured at 60°C for ...

Embodiment 2

[0082] Production and evaluation of an input antenna for RFID were performed in the same manner as in Example 1 except that (A / B) of the adhesive used was adjusted to 0.9.

Embodiment 3

[0084] Production and evaluation of an input antenna for RFID were performed in the same manner as in Example 1 except that (A / B) of the adhesive used was adjusted to 1.5.

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Abstract

[problem]To provide an RFID input antenna, which ahcieves high adhesion strength with a coverage mateiral even without a hot-melt glue adhesive, and also has thermal stability and is free of adhesion even at high temperatures; [solution] the RFID input antenna includes a circuit (101) formed by an medium adhesion layer (102) on at least one side of a resin thin film (103), in the RFID input antenna, the resin thin film is higher than 225 DEG C in melting point, the medium adhesion layer (102) comprises vinyl acetate resin with the content being A% by mass and polyurethane resin with the content being B% by mass, 0.9 <= A / B <= 3.4 and (A+B) <= 50.

Description

technical field [0001] The present invention relates to a circuit structure having circuits on one or both sides of a resin film. Background technique [0002] An input antenna used in conventional RFID has a metal circuit on one or both sides of a resin film via an adhesive. Considering heat resistance, dimensional stability, etc., polyethylene terephthalate film (PET), polyethylene naphthalate film (PEN) and polyimide film ( PI) etc. [0003] On the other hand, the cover material (caber material) enclosing the input antenna is selected in consideration of adhesiveness with the input antenna, suitability for printing on the surface of the cover material, cost, and the like. Specifically, polycarbonate (PC), polyvinyl chloride (PVC), amorphous polyethylene terephthalate (PET-G), paper, etc. can be selected. In Europe and the United States, considering the cost and performance And PVC is widely used. [0004] The input antenna and the cover material are usually bonded bet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38
Inventor 田健吾
Owner TOYO ALUMINIUM KK