Composite graphene microchip heat dissipation master batch and preparation method and application thereof

A graphene micro-sheet and composite graphite technology, applied in the field of graphene materials, can solve the problems of adding price, expensive small molecule stabilizers, limited application of graphene, etc., and achieve good mechanical properties, efficient thermal conductivity, and easy to increase. The effect of large-scale industrial operations

Active Publication Date: 2016-06-22
陕西千弘同高信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although there are some methods to inhibit the occurrence of graphene agglomeration, this requires precise control of reaction conditions, or the addition of expensive small molecule stabilizers, the use of special organic solvents, etc.
And this storage condition limits the application of graphene

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Composite graphene microchip heat dissipation masterbatch is prepared from the following raw materials in parts by weight: 60 parts of flake graphite; 20 parts of boron nitride with a particle size of 5-12 μm and a pore size of 20-50 nm; 2.5 parts of diamine; 0.5 part of monoisocyanate.

[0048] Composite graphene microchip heat dissipation masterbatch is prepared by the following method:

[0049] (1) Add 60 parts by weight of graphite powder and 2 parts by weight of dimerized fatty acid into a ball mill, and grind for 20 minutes under nitrogen protection conditions, so that the interface between dimerized fatty acid and graphite powder is attached;

[0050] (2) Mix the mixture obtained in step (1) with 20 parts by weight of three-dimensional porous boron nitride, and then put it into a co-rotating twin-screw extruder, and the twin-screw extruder is sequentially set from the feed end to the discharge end. Cutting section, polymerization mixing section, devolatilization...

Embodiment 2

[0055] Composite graphene microchip heat dissipation masterbatch is prepared from the following raw materials in parts by weight: 55 parts of expanded graphite; 25 parts of zinc oxide with a particle size of 5-12 μm and a pore size of 20-50 nm; 3 parts of dimer fatty acid; 1, 4 parts of 4-butanediamine; 0.4 parts of monoisocyanate.

[0056] Composite graphene microchip heat dissipation masterbatch is prepared by the following method:

[0057] (1) Add 55 parts by weight of graphite powder and 3 parts by weight of dimerized fatty acid into a ball mill, and grind for 30 minutes under nitrogen protection, so that the interface between dimerized fatty acid and graphite powder is attached;

[0058] (2) Mix the mixture obtained in step (1) with 25 parts by weight of three-dimensional porous zinc oxide and add it into a co-rotating three-screw extruder. The screw extruder is sequentially set from the feed end to the discharge end. In the mixing section, devolatilization section, and ...

Embodiment 3

[0063] Composite graphene microchip heat dissipation masterbatch is prepared from the following raw materials in parts by weight: 50 parts of highly oriented graphite; 30 parts of white carbon black with a particle size of 5-12 μm and a pore size of 20-50 nm; 3 parts of dimerized fatty acid; 3 parts of 1,4-butanediamine; 0.3 parts of monoisocyanate.

[0064] Composite graphene microchip heat dissipation masterbatch is prepared by the following method:

[0065] (1) Add 50 parts by weight of graphite powder and 3 parts by weight of dimerized fatty acid into a ball mill, and grind for 30 minutes under nitrogen protection, so that the interface between dimerized fatty acid and graphite powder is attached;

[0066] (2) Mix the mixture obtained in step (1) with 30 parts by weight of three-dimensional porous white carbon black and add them into a co-rotating four-screw extruder. The screw extruder is sequentially set with a shear section, In the polymerization mixing section, devola...

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Abstract

The invention relates to the field of graphene materials, in particular to a composite graphene microchip heat dissipation master batch. According to the defects that due to the fact that graphene powder which is directly added to and applied in plastics is difficult to disperse, heat dispersion is affected, and agglomeration is prone to occur in graphene preparation and storage, a screw extruder is utilized to serve as a continuous reactor, the graphene powder is subjected to stripping at the same time of being subjected to dispersion and fixation through three-dimensional porous inorganic matter, and a heat conduction network is formed through continuous polymerization. The defects that agglomeration is prone to occur in graphene preparation and storage, and dispersion is difficult to achieve in the application process are overcome. Therefore, application of graphene serving as an efficient heat dispersing material in the field of the plastics is promoted. The composite graphene microchip heat dissipation master batch can be directly added for use just like ordinary master batches in the field of the plastics, is widely applied to high-load rubber tire heat dissipation, rubber pad heat dissipation, electronic component joint heat dissipation, LED heat dissipation and the like and has a wide market prospect.

Description

technical field [0001] The invention relates to the field of graphene materials, in particular to a composite graphene microchip heat dissipation masterbatch and its preparation method and application. Background technique [0002] For a long time, metal aluminum alloy materials have been used as heat dissipation materials in various industrial and electronic products. However, with the advancement of polymer science and technology and the rapid upgrading of industries, new performance requirements are put forward for polymer materials, and it is hoped that polymer materials will also become good conductors of heat. At present, heat dissipation is required in fields such as high-load rubber, heat exchange engineering, electromagnetic shielding, electronics, friction materials, computer cooling accessories, LED lighting components, optical components, mechanical components, auto parts, and contact materials. However, traditional metal aluminum alloy materials are difficult t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/04C08K3/04C08K3/38C08K3/22C08K3/36C08G69/28C08G69/48C08L21/00C08L81/02C08L83/04C08L33/12
CPCC08G69/28C08G69/48C08K3/04C08K3/22C08K3/36C08K3/38C08K9/04C08L2201/08C08L2203/20C08L33/12C08L83/04C08L81/02C08L21/00
Inventor 陈庆曾军堂
Owner 陕西千弘同高信息科技有限公司
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