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A solution for electroless nickel plating on the surface of non-catalytically active materials and its plating process

An electroless nickel plating, non-catalytic technology, applied in the field of electroless plating, can solve the problems such as the decrease of the deposition rate of the coating layer, the inability to reuse the plating solution, the decrease of the pH value of the plating solution, etc., and achieve the effect of smooth surface, low cost and fast plating speed.

Active Publication Date: 2017-12-29
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] An object of the present invention is to address the problems existing in the plating solution formulation system for nickel plating on non-catalytically active metals and / or non-metal surfaces: as time goes on, the pH of the plating solution will be reduced due to the consumption of the plating solution formulation components in different degrees. The decrease of the value, the decrease of the deposition rate of the coating, the content of phosphorus in the coating and the change of the thickness of the coating, at the same time lead to the decrease of the stability of the plating solution, so that the plating solution cannot be reused

Method used

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  • A solution for electroless nickel plating on the surface of non-catalytically active materials and its plating process

Examples

Experimental program
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Embodiment 1

[0070] Liquid A: 300g of nickel sulfate and 50g of ammonium fluoride per liter;

[0071] Solution B: Each liter contains 260g of sodium hypophosphite, 210g of citric acid monohydrate, 200g of ammonium fluoride, 0.02g of thiourea, and 0.15g of sodium lauryl sulfate. Take 10% of liquid A, 10% of liquid B and 80% of deionized water according to volume percentage, mix them evenly, adjust the pH to 7.7-8.0 with ammonia water, and form an electroless plating solution; pretreat the copper sheets that need to be nickel-plated, Then degrease with alkali washing solution for 3-5 minutes at 60°C-70°C, wash with water for the first time, pickle with acid at room temperature for about 30s, and wash with water for the second time; In the electroless plating solution at 88°C, the load of the plated parts is 0.6dm 2 / L, put the iron piece in contact with the copper piece for primer plating, take out the iron piece after the electroless plating occurs; take out the nickel-plated piece after 6...

Embodiment 2

[0074] Liquid A: 320g of nickel sulfate and 50g of ammonium fluoride per liter;

[0075] Liquid B: containing 250g of sodium hypophosphite, 200g of citric acid monohydrate, 200g of ammonium fluoride, 0.02g of thiourea, and 0.15g of sodium lauryl sulfate per liter;

[0076] Liquid D: 320g of nickel sulfate and 0.02g of thiourea per liter;

[0077] According to volume percentage, take 10% of liquid A, 10% of liquid B and 80% of deionized water, mix them evenly, adjust the pH to 7.7-8.0 with ammonia water, and form an electroless plating solution; put the processed parts to be plated into the heated In the electroless plating solution at 85°C, use an iron plate to lead the plating, and carry out nickel plating at a stable temperature of 85°C, with a load of 0.6dm 2 / L; after plating for 60 minutes, take out the nickel-plated parts, wash with water, dry or dry, filter the plating solution at the same time, and clean the plating tank; then add the above-mentioned plating solution ...

Embodiment 3

[0080] Liquid C: 480g of nickel sulfate and 100g of citric acid monohydrate per liter;

[0081] Carry out plating and replenishment by the method for embodiment 2, replenish twice and after carrying out electroless plating, after plating solution and plating tank are processed, the solution after plating continues to replenish for the third time, every liter of plating solution adds 20ml of solution C and 25ml of solution D, stir to mix the components of the plating solution in the plating tank evenly, adjust the pH to 7.7-8.0 with ammonia water, and obtain a new plating solution; heat the new plating solution to 85°C, and then add the new parts to the plating solution. Carry out electroless plating in the solution, use iron sheet to lead plating, and take out the plated parts that have been plated with nickel after 60 minutes of plating, wash with water, and blow dry. The plating solution can be recycled. On the basis of the third addition, the plating solution can be added c...

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Abstract

The invention relates to a solution for chemically plating nickel on the surface of a non-catalytic active material and a plating process for the solution, and belongs to the technical field of chemical nickel-plating. The solution comprises liquor A, liquor B, liquor C and / or liquor D, wherein the liquor A comprises a water-soluble nickel salt and a buffer agent; the liquor B comprises a reducing agent, a complexing agent, a buffer agent, a stabilizer and a surface wetting agent; the liquor C comprises the water-soluble nickel salt and the complexing agent; and the liquor D comprises the reducing agent and the stabilizer. The plating process for the solution comprises the following steps: preparing the liquor A, the liquor B and a diluent; uniformly mixing the liquor A, the liquor B and the diluent to obtain a mixture, regulating the pH value of the mixture to 7.0-8.0, heating the mixture to a temperature of 82-88 DEG C, and carrying out primary plating by using an iron material as an initiator; filtering plating liquor after carrying out primary plating; recycling filtrate for next-time plating, feeding plating liquor obtained by the next-time plating into the liquor C and the liquor D, and recycling the plating liquor. According to the solution and the plating process thereof, the combination and the process design are reasonable, generation and emission of waste liquor can be greatly reduced, and the utilization rate of the plating liquor can be increased.

Description

technical field [0001] The invention relates to a solution for electroless nickel plating on the surface of a non-catalytically active material and a plating process thereof, belonging to the technical field of electroless plating. Background technique [0002] Electroless plating is a plating method in which oxidation-reduction occurs in the same solution with the help of a reducing agent when no current passes, so that metal ions are reduced and deposited on the self-catalytic surface. It is also known as electroless plating or autocatalytic plating. [0003] The composition of the electroless plating solution and the corresponding working conditions must be such that the reaction is limited to the surface of the substrate with catalytic effect, but in the solution body, the reaction should not occur spontaneously, so as to avoid the natural decomposition of the solution. pH, temperature, stirring speed, etc. can adjust the plating speed of electroless plating. For the el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36
CPCC23C18/36
Inventor 石西昌李志伟王尚兴陈亚徐徽杨喜云
Owner CENT SOUTH UNIV