Near-distance copper needle packaging structure and preparation method thereof

Abstract

The invention provides a near-distance copper needle packaging structure and a preparation method thereof. The near-distance copper needle packaging structure comprises chips and copper needle structures, wherein the copper needle structures are fixedly connected with the chips in a welded manner; the surfaces of the copper needle structures are wrapped by diffusion baffle layers; and metal convex blocks are formed at the upper ends of copper needles in a backflow manner. According to the near-distance copper needle packaging structure, copper wires are wrapped by an inert metal and are separated into a great amount of copper needles, and subsequently the copper needles are directly inserted in positions where copper pillar bumps are to be manufactured on the chips, so that a conventional process that copper pillars are manufactured in an electroplating manner is replaced, the process time is greatly shortened, and the process cost is greatly reduced. As the surfaces of the copper needles are wrapped by inert metal protecting layers, diffusion of copper atoms can be reduced, the distance among the copper pillar bumps can be reduced, and the copper pin packaging and stacking capability can be greatly improved. The near-distance copper needle packaging structure is simple in process and structure, can effectively improve the chip performance, and has wide application prospects in the field of semiconductor packaging.

Description

technical field [0001] The invention relates to a semiconductor package structure and method, in particular to a close-pitch copper needle package structure and a preparation method thereof. Background technique [0002] With the increasingly powerful functions of integrated circuits, higher performance and higher integration, and the emergence of new integrated circuits, packaging technology plays an increasingly important role in integrated circuit products, and in the value of the entire electronic system The proportion is increasing. At the same time, as the feature size of integrated circuits reaches the nanometer level, transistors are developing towards higher density and higher clock frequency, and packaging is also developing towards higher density. As packaging density continues to increase, chip-to-chip or chip-to-package substrate narrow-pitch electrical interconnections and their reliability have become a challenge. Traditional lead-free solder bump technology...

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a close-pitch copper needle packaging structure and its preparation method, which is used to solve the problem of the short-pitch copper pillar bump structure in the prior art due to the diffusion of copper atoms. Chip short circuit, complex steps of preparation method and high cost

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