Two-component silicone potting compound and its preparation process

A silicone potting glue, two-component technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problem of low light output rate, affecting life and application, and poor heat dissipation of high-power LEDs and other problems, to achieve the effect of excellent mechanical properties and good viscosity properties

Active Publication Date: 2019-06-11
深圳市欧普特工业材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High-power LEDs still have the problems of poor heat dissipation and low light output rate, because heat dissipation directly affects the reliability of LEDs, and then affects their life and applications, and low light output rate directly restricts the development of LEDs, so LED packaging materials It is particularly important to study the thermal conductivity, flame retardancy and light extraction properties of

Method used

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  • Two-component silicone potting compound and its preparation process
  • Two-component silicone potting compound and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Component A: Vinyl silicone oil, dimethyl silicone oil, silicon micropowder, aluminum oxide, aluminum nitride, boron nitride, LSR base glue, platinum catalyst The weight ratio is: 100:60:25:8:8:8: 25:2;

[0034] Component B: Vinyl silicone oil, dimethyl silicone oil, methyl hydrogen siloxane, silicon micropowder, aluminum oxide, LSR base glue, white carbon black, tackifier, inhibitor weight ratio: 100:60:25 :25:8:25:10:0.5:2;

[0035] For component A: high-speed dispersion and mixing of vinyl silicone oil, silicon micropowder, aluminum oxide, aluminum nitride and boron nitride; add the high-speed dispersion and mixing material into LSR base glue and mix with platinum catalyst, dimethyl silicone oil, Degassing and curing to obtain component A;

[0036] For component B: Disperse and mix vinyl silicone oil, simethicone oil and alumina at high speed; add the material after high-speed dispersion and mixing to LSR base glue and mix with methyl hydrogen siloxane, silicon mic...

Embodiment 2

[0039] Embodiment 2 differs from Embodiment 1 in that:

[0040] Component A: Vinyl silicone oil, dimethyl silicone oil, silicon micropowder, aluminum oxide, aluminum nitride, boron nitride, LSR base glue, platinum catalyst The weight ratio is: 100:50:20:5:5:5: 20:0.5;

[0041] Component B: Vinyl silicone oil, dimethyl silicone oil, methyl hydrogen siloxane, silicon micropowder, aluminum oxide, LSR base glue, white carbon black, tackifier, inhibitor weight ratio: 100:50:20 :20:5:20:5:0.1:0.1.

Embodiment 3

[0043] Embodiment 3 differs from Embodiment 1 in that:

[0044] Component A: Vinyl silicone oil, dimethyl silicone oil, silicon micropowder, aluminum oxide, aluminum nitride, boron nitride, LSR base glue, platinum catalyst The weight ratio is: 100:65:30:10:10:10: 30:3;

[0045] Component B: Vinyl silicone oil, dimethyl silicone oil, methyl hydrogen siloxane, silicon micropowder, aluminum oxide, LSR base glue, white carbon black, tackifier, inhibitor weight ratio: 100:65:30 :30:10:30:15:1:3.

[0046] For the product that embodiment 1~3 makes, we have carried out measurement, draw following result:

[0047] Curing time<480min(25℃),<20min(80℃);

[0048] Thermal conductivity ≥ 3.0W / m·k;

[0049] Dielectric strength ≥ 27kV / mm;

[0050] Dielectric constant 3.0 ~ 3.3 (1.2MHz);

[0051] Volume resistivity ≥ 1.0×1014Ω·cm (25°C);

[0052] Linear expansion coefficient≤2.2×10-4m / (m·K)

[0053] Therefore, the present invention has high thermal conductivity and good flame retardancy...

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Abstract

The invention discloses a two-component organic silicon pouring sealant and a preparation process thereof. The two-component organic silicon pouring sealant comprises a component A and a component B, wherein the component A is prepared by mixing vinyl silicone oil, simethicone, silica powder, alumina, aluminum nitride, LSR base glue and a platinum catalyst in a certain weight ratio; and the component B is prepared by mixing vinyl silicone oil, simethicone, methyl hydrogen siloxane, silica powder, alumina, LSR base glue, white carbon black, a tackifier and an inhibitor in a certain weight ratio; and the mixing ratio of the component A and the component B is 1 to 1. The preparation process comprises the following steps: (1) preparing the component A; (2) preparing the component B; and (C) uniformly mixing the component A with the component B in a mass ratio of 1 to 1 under the high-speed shearing and dispersing, adding the mixture into a vacuum drying chamber, carrying out vacuum defoamation for 10 minutes, pouring the mixture into a mold, and curing at the room temperature or heating to cure.

Description

technical field [0001] The invention relates to a two-component glue, in particular to a two-component silicone potting glue. Background technique [0002] Silicone potting adhesive is widely used in the field of electronic potting due to its excellent electrical insulation performance, high temperature resistance and aging resistance, good chemical stability, and simple processing technology. The role of dust can not only improve the performance of electronic products, but also stabilize the parameters of electronic components. However, ordinary silicone potting adhesives have disadvantages such as low thermal conductivity, poor flame retardancy and poor bonding performance, which seriously affect their application range. With the development of modern information technology, the densification and miniaturization of electronic components and logic circuits and the increase of electrical power have led to an increase in the heat per unit area of ​​electronic products. new ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/04
CPCC08L2201/02C08L2201/22C09J11/04C09J183/04C08L83/04C08K13/02C08K3/36C08K2003/2227C08K2003/282C08K2003/385
Inventor 刘诚邱礼卫谭培于吴先信张最斌
Owner 深圳市欧普特工业材料有限公司
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