Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy molding compound containing triblock polymer

A technology of epoxy molding compound and polymer, which is applied in the direction of electrical components, circuits, and electrical solid devices, and can solve problems such as high thermal stress, reduced device reliability, and surface cracking of packaging materials

Inactive Publication Date: 2016-07-20
BEIJING SHOUKEHUA MICRO ELECTRONICS
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional plastic packaging materials will generate relatively high thermal stress during reflow soldering, which will lead to surface cracking and delamination of the packaging material, thereby reducing the reliability of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy molding compound containing triblock polymer
  • Epoxy molding compound containing triblock polymer
  • Epoxy molding compound containing triblock polymer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] O-cresol novolac epoxy resin A1 ("CYDCN-200H" produced by Baling Petrochemical) 12wt%

[0031] Phenol novolac resin B1 ("TD-2131" manufactured by DIC Corporation of Japan) 6 wt%

[0032] 2-Methylimidazole C10.05wt%

[0033] Silica powder D (d50 is 23um) 67.93wt%

[0034] Polystyrene-polybutadiene-polystyrene triblock polymer E15wt%

[0035] Liquid silicone oil 1wt%

[0036] Carnauba wax 1.5wt%

[0037] Vinyltriethoxysilane 1.5wt%

[0038] Magnesium hydroxide (d50 is 1μm) 4.47wt%

[0039] Carbon black 0.55wt%

[0040] Weighing according to the above proportions, first crush the weighed o-cresol novolac epoxy resin and phenol novolac phenolic resin, and mix them at room temperature for about 10 minutes to obtain a uniformly mixed primary mixture; then add other components weighing Take the material and mix it for about 10 minutes to obtain a uniform mixture, and then melt and knead the mixture on a double-roller kneader with a temperature of 60-110°C preheated; Ta...

Embodiment 2～12

[0044] The composition of the molding material of the low modulus epoxy molding compound containing triblock polymer is shown in Table 1, the preparation method is the same as in Example 1, the evaluation method is the same as in Example 1, and the evaluation results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a low-modulus epoxy molding compound containing a triblock polymer and being able to improve the toughness of an epoxy molding compound molded material. The epoxy molding compound contains 5-18wt% of epoxy resin, 2.5-10wt% of phenolic resin, 0.05-0.5wt% of a curing accelerator, 60-90wt% of a filler, 0.5-10wt% of the triblock polymer, 0.1-1.5wt% of a mold lubricant and 0.3-1.5wt% of a coupling agent. The powdery low-modulus epoxy molding compound containing the triblock polymer, having excellent toughness and used for semiconductor packaging, is prepared through the following steps: crushing the epoxy resin and the phenolic resin, mixing the crushed epoxy resin and phenolic resin until uniformity, adding the curing accelerator, the filler, the triblock polymer, the mold lubricant and the coupling agent, carrying out melt mixing on the obtained mixture in a double drum mixer until uniformity, taking out the mixture, naturally cooling the mixture, and crushing the cooled mixture.

Description

technical field [0001] The invention relates to an epoxy molding compound for semiconductor packaging, in particular to an epoxy molding compound containing a three-block polymer that can improve the toughness of an epoxy molding compound molding material. Background technique [0002] Epoxy molding compound has many excellent properties and has been widely used in the field of packaging. It is the mainstream material for semiconductor components and integrated circuit packaging. In recent years, semiconductors have developed towards high integration, with larger chips, more complex structures, and finer wiring; the corresponding packages have developed toward smaller and thinner profiles. Traditional plastic encapsulation compounds will generate relatively high thermal stress during reflow soldering, which will lead to cracking and delamination on the surface of the encapsulation material, thereby reducing the reliability of the device. In order to adapt to the development...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08L63/04C08L61/06C08L53/00C08L53/02H01L23/29
Inventor 余金光李刚王善学卢绪奎李海亮
Owner BEIJING SHOUKEHUA MICRO ELECTRONICS