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High temperature TFT (Thin Film Transistor) composite flexible substrate, preparation method of the high temperature TFT composite flexible substrate and flexible display device preparation method

A composite flexible and flexible substrate technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the requirements that do not meet the development requirements of high-resolution flexible displays, affect the accuracy and uniformity of TFT devices, and thermal expansion coefficient Large and other problems, achieve the effect of strengthening mechanical stability, suppressing thermal expansion, and reducing thermal expansion coefficient

Inactive Publication Date: 2016-07-20
SHENZHEN TCL IND RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Restricted by flexible substrates such as PET, PEN and other materials, the heat treatment temperature is only suitable for low-temperature flexible displays, and does not meet the requirements for the development of high-resolution flexible displays
[0006] However, some flexible substrate materials commonly used in high-temperature TFTs can meet the requirements of high-temperature TFTs in terms of temperature resistance, but due to the large thermal expansion coefficient and small elastic modulus of the materials; under high-temperature process conditions, the substrate is prone to deformation and warpage. , thus affecting the accuracy and uniformity of TFT device fabrication

Method used

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  • High temperature TFT (Thin Film Transistor) composite flexible substrate, preparation method of the high temperature TFT composite flexible substrate and flexible display device preparation method
  • High temperature TFT (Thin Film Transistor) composite flexible substrate, preparation method of the high temperature TFT composite flexible substrate and flexible display device preparation method
  • High temperature TFT (Thin Film Transistor) composite flexible substrate, preparation method of the high temperature TFT composite flexible substrate and flexible display device preparation method

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preparation example Construction

[0056] In the preparation process of the present invention, nanoimprinting technology is used to form a skeleton model on the surface of the flexible substrate layer 10, and then filled with materials to form a reinforced skeleton 20. Embedding the skeleton into the flexible substrate layer 10, when the flexible substrate layer 10 thermally expands, it can restrict and slow down the molecular flow of its expansion, and at the same time, under the internal support of the skeleton, the toughness and elasticity of the flexible material itself can be further strengthened Modulus and other mechanical properties; and the nanoimprinting method has the least impact on the flexible substrate layer 10 as a flexible display substrate.

[0057] Among them, in this step S10, the flexible substrate layer 10 is obtained as the substrate to be produced, which can be directly used in the present invention by using an existing independent flexible substrate that can meet the requirements of the ...

Embodiment 1

[0088] In this embodiment 1, a phthalic anhydride-type PI resin material is used to realize the preparation of a composite flexible substrate, and a high-brightness glass plate is used as a hard substrate as an example.

[0089] S11, selecting a high-brightness glass plate as the hard substrate, and ultrasonically cleaning the hard substrate, and then performing plasma treatment on the surface of the glass plate with nitrogen gas after cleaning, for standby;

[0090] S12, pour the PI resin solution into the cavity of the scraping knife, and slowly and evenly coat the PI resin solution on the surface of the high-gloss glass plate to form an intermediary layer; then use the method of spin coating (Spincoating) to carry out Rotate to make the intermediary layer formed by doctor blade coating to a uniform thickness of 2 μm to 5 μm, then place it in a radiation oven filled with nitrogen atmosphere, and heat it with infrared radiation until the intermediary layer of PI resin is cross...

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Abstract

The invention discloses a high temperature TFT (Thin Film Transistor) composite flexible substrate. The flexible substrate comprises a flexible substrate layer and reinforcement skeletons. Groove parts are arranged in the surface of the flexible substrate layer for preparing a display device, wherein the groove parts fit with reinforcement skeletons; the reinforcement skeletons are embedded in the flexible substrate layer through the groove parts; and a surface flat layer is also arranged on the surface of the flexible substrate layer for preparing the display device. According to the high temperature TFT composite flexible substrate, through increasing a skeleton support structure in the flexible substrate layer, the coefficient of thermal expansion of the flexible substrate can be reduced, the elastic modulus of the substrate can be increased, and the problems that the substrate made of a high-molecular polymer material deforms and warps in a high temperature technological condition can be effectively solved. Through coating the surface flat layer on the surface of the flexible substrate layer equipped with the reinforcement skeletons, the surface flat precisions of the flexible substrate in preparation of the flexible device tend to be consistent, the processing precision of the TFT on the flexible substrate is improved, and the alignment errors resulting from the deformation of the flexible substrate in an IC binding process are reduced.

Description

technical field [0001] The invention belongs to the technical field of flexible display preparation, and in particular relates to a high-temperature TFT composite flexible substrate, a preparation method, and a preparation method of a flexible display device. Background technique [0002] Devices such as curved screen mobile phones and curved TVs with fully flexible displays need to be based on flexible substrate materials as the carrier substrate of the device, and require a certain bending radius for the electrode layer, TFT matrix, display device, and packaging layer to achieve full flexibility. Flexibility, including electronic paper, flexible liquid crystal displays and flexible organic electroluminescent display devices. In the existing mass industrial production, there are mainly two types of manufacturing display devices on flexible substrates: R2R (roll to roll, roll to roll) production process and S2S (sheet to sheet, sheet to sheet) production process. [0003] A...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
Inventor 高卓
Owner SHENZHEN TCL IND RES INST
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