A method for curing diamond resin wire by microwave-ultraviolet light combination

A technology of diamond resin wire and ultraviolet light, which is applied in the direction of chemical instruments and methods, chemical/physical/physicochemical processes of energy application, chemical/physical processes, etc., can solve the problem of difficult uniform and complete resin curing, long electrothermal curing time, High production cost and other issues, to achieve the effect of shortening drying time, small surface damage, and small deflection deformation

Active Publication Date: 2019-03-08
广东烯王科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The bonded abrasive grain wire saw of the resin bonded diamond wire saw is because the electrothermal curing time of the thermosetting resin used as the bonding agent is too long, and there is inevitably a temperature gradient inside the material. As a result, the curing of the resin is difficult to be uniform and complete, thus It is easy to generate large internal stress and the production cost is too high

Method used

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  • A method for curing diamond resin wire by microwave-ultraviolet light combination

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The concrete steps of the method for solidifying the diamond resin wire by combining microwave-ultraviolet light of the present invention are as follows:

[0043] (1) mixing the heat-curable resin and the light-curable resin to form a mixed resin;

[0044] (2) the diamond particles are made into a slurry according to the volume ratio of 1% and the mixed resin;

[0045] (3) uniformly coating the slurry on the surface of the metal core wire to obtain a resin wire;

[0046] (4) Curing the resin wire through a curing device containing microwaves and ultraviolet light, controlling the microwave energy field and the luminous intensity of ultraviolet light by adjusting the microwave power, to obtain a cured diamond resin wire;

[0047] (5) The cured diamond resin wire is dried to obtain the final product.

[0048] In step (1), the thermosetting resin is phenolic resin; the photocuring resin is polyurethane acrylic resin; the volume ratio of the two is 2:1.

[0049] In step ...

Embodiment 2

[0053] The concrete steps of the method for solidifying the diamond resin wire by combining microwave-ultraviolet light of the present invention are as follows:

[0054] (1) mixing the heat-curable resin and the light-curable resin to form a mixed resin;

[0055] (2) the diamond particles are made into a slurry according to the volume ratio of 30% and the mixed resin;

[0056] (3) uniformly coating the slurry on the surface of the metal core wire to obtain a resin wire;

[0057] (4) Curing the resin wire through a curing device containing microwaves and ultraviolet light, controlling the microwave energy field and the luminous intensity of ultraviolet light by adjusting the microwave power, to obtain a cured diamond resin wire;

[0058] (5) The cured diamond resin wire is dried to obtain the final product.

[0059] In step (1), the thermosetting resin is polyester resin and polyamide resin; the photocuring resin is epoxy acrylic resin; the volume ratio of the three is 5:3:6....

Embodiment 3

[0064] The concrete steps of the method for solidifying the diamond resin wire by combining microwave-ultraviolet light of the present invention are as follows:

[0065] (1) According to the volume ratio, epoxy resin and novolac epoxy acrylic resin are configured into mixed resin with a ratio of 1:1;

[0066] (2) Take 150 / 125 mesh diamond as an example, add 15% by volume to the prepared mixed resin;

[0067] (3) take the metal twisted pair as the core wire, and its diameter is 200 microns. After surface washing and activation treatment, the diamond resin obtained above is coated on the core wire surface, and then through the 230 micron diameter limiting mold, the The resin wire is wound into the microwave-ultraviolet combined device system;

[0068] (4) Pass the resin line through the microwave-ultraviolet combined device at a speed of 2m / s, wherein the microwave power is 0.2w / cm 2 , the intensity of ultraviolet light is 120w / cm 2 ;

[0069] (5) The obtained diamond resin ...

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Abstract

The invention discloses a method for curing a diamond resin line by microwave-ultraviolet combined use type. The method comprises the following steps of arranging the diamond resin line in a microwave and ultraviolet-containing curing device, and curing, wherein the diamond resin line comprises a diamond-containing resin coating layer and a metal core layer; the resin is a mixed resin which comprises a thermosetting resin and a photocuring resin. The method has the advantages that industrial microwave heating and ultraviolet curing techniques are applied into the production of the diamond resin line, the traditional processing type of the diamond resin line is changed by utilizing the advantages of microwave heating and ultraviolet curing, the resin drying time is shortened, the curing of the resin line is more uniform, the holding force of diamond on the line is enhanced, and the cutting efficiency is improved; the traditional coating type of the resin line is changed, the exposure speed of the diamond on the line is high, and the defect of exposure only by removing the surface coating layer of the diamond in the preliminary stage is overcome.

Description

technical field [0001] The invention relates to the technical field of resin curing, in particular to a method for curing diamond resin wires by combining microwave and ultraviolet light. Background technique [0002] At present, Chinese photovoltaic enterprises are already at the advanced level in the world in terms of silicon wafer, sapphire cutting technology, cell and module production technology. With the rapid rise of emerging markets such as China's domestic photovoltaic market and foreign markets, photovoltaic companies have increasingly urgent requirements for basic process technology progress. The continuous improvement of crystal silicon wafer cutting technology has become an internal requirement for domestic slicing companies to seize the commanding heights of future market competition. [0003] In order to reduce costs, manufacturers can achieve it through the following means: [0004] 1. Reduce the kerf loss. The kerf loss is mainly related to the diameter of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J19/12
CPCB01J19/123B01J19/126
Inventor 谭雪姣孙孝德
Owner 广东烯王科技有限公司
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