Epoxy resin adhesive

Abstract

The invention discloses an epoxy resin adhesive which is prepared from a bisphenol F epoxy resin, methyl methacrylate, a polyphenol glycidol ether epoxy resin, mica powder, epoxypropane phenyl ether, diepoxypropane ethyl ether, aluminum hydroxide powder, aids, a diethylenetriamine-diaminodiphenylmethane mixture and polyorganosiloxane. By improving the production technique and formula, the prepared epoxy resin adhesive has the advantages of lower viscosity and favorable impregnation property, and can fully fill between the element and connecting line. The epoxy resin adhesive has long usable life, and is suitable for production operation in automatic assembly line industry. The epoxy resin adhesive can not generate stratification in the curing process, and has high curing speed. The epoxy resin adhesive has the advantages of low curing heat output and small shrinkage. The curing product has the advantages of smooth surface, high brightness, high hardness, excellent insulating property, favorable mechanical properties, favorable heat resistance, low water absorptivity and low thermal expansion coefficient. The epoxy resin adhesive is applicable to various IC (integrated circuit) plastic films, inductors, capacitors and other electronic parts in the aspects of insulation, pin fixation and moistureproof potting.

Description

Technical field [0001] The invention relates to the field of adhesives, in particular to an epoxy resin adhesive. Background technique [0002] Since the 1950s, with the development of the electronics industry in the direction of miniaturization, light weight, and precision, epoxy adhesives have been widely used in the electronic component manufacturing industry and have become an important insulating material in the electronics industry. However, the epoxy adhesives in the prior art are generally two-component and can be cured at room temperature, but the use and performance are not ideal, the processability is poor, and the comprehensive curing performance is poor. Summary of the invention [0003] The object of the present invention is to provide an epoxy resin adhesive. [0004] The present invention is realized through the following technical solutions: [0005] An epoxy resin adhesive, in parts by weight, made of the following components: 100 parts of bisphenol F epoxy resin, ...

AI Technical Summary

Problems solved by technology

However, the epoxy adhesives in the prior art are generally two-component and can be cured at room temperature, but the use and performance are not ideal, the manufacturability is poor, and the curing comprehensive performance is poor.