Niobium-doped tin dioxide transparent electric conducting film and preparation method thereof
A transparent conductive film, tin dioxide technology, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of difficult control of preparation technology, difficult to guarantee photoelectric performance, and inability to use in practical production. Good chemical stability, excellent optoelectronic properties, low cost effect
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Embodiment 1
[0048] The niobium-doped tin dioxide transparent conductive film of the present embodiment is composed of the following atomic percentages: O66.94%, and the rest are Nb and Sn (the total atomic number of Nb, Sn and O is 100%); wherein , the number of atoms of Nb is 5% of the total number of atoms of Nb and Sn.
[0049] The preparation method of the niobium-doped tin dioxide transparent conductive film of the present embodiment comprises the following steps:
[0050] 1) Argon is used as the plasma gas source, oxygen is used as the reaction gas, and the remote plasma sputtering technology is used to deposit the thin film on the glass substrate by reactive sputtering, specifically:
[0051] Fix the cleaned glass substrate on the sample stage in the sputtering chamber of the remote plasma sputtering system; before reactive sputtering, vacuum the sputtering chamber to a vacuum degree better than 2.0×10 -3 Pa, then feed the argon gas with a flow rate of 70 sccm into the chamber, an...
Embodiment 2
[0059] The niobium-doped tin dioxide transparent conductive film of the present embodiment is composed of the following atomic percentages: O67.00%, and the rest are Nb and Sn (the total atomic number of Nb, Sn and O is 100%); wherein , the number of atoms of Nb is 6% of the total number of atoms of Nb and Sn.
[0060] The preparation method of the niobium-doped tin dioxide transparent conductive film of the present embodiment comprises the following steps:
[0061] 1) Argon is used as the plasma gas source, oxygen is used as the reaction gas, and the remote plasma sputtering technology is used to deposit the thin film on the glass substrate by reactive sputtering, specifically:
[0062] Fix the cleaned glass substrate on the sample stage in the sputtering chamber of the remote plasma sputtering system; before reactive sputtering, evacuate the sputtering chamber to a vacuum degree better than 2.0×10 -3 Pa, then feed the argon gas with a flow rate of 200 sccm into the chamber,...
Embodiment 3
[0073] The niobium-doped tin dioxide transparent conductive film of the present embodiment is composed of the following atomic percentages: O67.00%, and the rest are Nb and Sn (the total atomic number of Nb, Sn and O is 100%); wherein , the number of atoms of Nb is 6% of the total number of atoms of Nb and Sn.
[0074] The preparation method of the niobium-doped tin dioxide transparent conductive film of the present embodiment comprises the following steps:
[0075] 1) With argon as the plasma gas source and oxygen as the reactive gas, the remote plasma sputtering technology was used to deposit thin films on transparent plastic (polyethylene naphthalate, PEN) substrates by reactive sputtering, specifically for:
[0076] Fix the cleaned glass substrate on the sample stage in the sputtering chamber of the remote plasma sputtering system; before reactive sputtering, evacuate the sputtering chamber to a vacuum degree better than 2.0×10 -3 Pa, then feed the argon gas with a flow ...
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Abstract
Description
Claims
Application Information
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