A metal oxide gas-sensing base material and its preparation method
A technology for sensing substrates and oxides, which is used in the analysis of materials, material analysis by electromagnetic means, instruments, etc. It can solve the problems of high working temperature, poor selectivity, baseline resistance drift, etc., and achieve good stability.
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Embodiment 1
[0021] A metal oxide gas-sensing base material, prepared from the following components in parts by weight: 5 parts of iron powder, 5 parts of tellurium powder, 1 part of nano-silicon dioxide, 10 parts of silicon wafer, N,N-dimethyl 20 parts of methyl formamide, 20 parts of hydrofluoric acid, 0.1 part of butyl hydroxyanisole, 1 part of calcium oxide, 1 part of sodium hydroxide, 20 parts of absolute ethanol, 15 parts of sulfuric acid, 5 parts of hydrogen peroxide, 20 parts of acetone , 30 parts of deionized water.
[0022] The preparation method of the above-mentioned metal oxide gas-sensitive sensing matrix material is as follows: first mix sulfuric acid and hydrogen peroxide evenly, put the silicon chip into it and ultrasonically clean it for 30 minutes; mix and dissolve sodium hydroxide with 20 parts of deionized water, and Put the silicon wafer in it for ultrasonic cleaning for 5 minutes; mix 10 parts of hydrofluoric acid and the remaining deionized water, put the silicon wa...
Embodiment 2
[0024] A metal oxide gas-sensing base material, which is prepared from the following components in parts by weight: 6 parts of iron powder, 6 parts of tellurium powder, 1.2 parts of nano-silicon dioxide, 12 parts of silicon wafer, N,N-dimethyl 22 parts of methyl formamide, 22 parts of hydrofluoric acid, 0.15 parts of butylated hydroxyanisole, 1.3 parts of calcium oxide, 1.2 parts of sodium hydroxide, 22 parts of absolute ethanol, 20 parts of sulfuric acid, 6 parts of hydrogen peroxide, and 22 parts of acetone , 35 parts of deionized water.
[0025] The preparation method of the above-mentioned metal oxide gas-sensitive sensing base material is as follows: first mix sulfuric acid and hydrogen peroxide evenly, put the silicon chip into it and ultrasonically clean it for 35 minutes; mix and dissolve sodium hydroxide with 20 parts of deionized water, and Put the silicon wafer in it for ultrasonic cleaning for 6 minutes; mix 15 parts of hydrofluoric acid and the remaining deionized...
Embodiment 3
[0027] A metal oxide gas-sensing substrate material, prepared from the following components in parts by weight: 7.5 parts of iron powder, 7.5 parts of tellurium powder, 1.5 parts of nano-silicon dioxide, 15 parts of silicon wafer, N,N-dimethyl 25 parts of methyl formamide, 25 parts of hydrofluoric acid, 0.2 parts of butylated hydroxyanisole, 1.5 parts of calcium oxide, 1.5 parts of sodium hydroxide, 25 parts of absolute ethanol, 22 parts of sulfuric acid, 7.5 parts of hydrogen peroxide, and 25 parts of acetone , 40 parts of deionized water.
[0028] The preparation method of the above-mentioned metal oxide gas-sensitive sensing base material is as follows: first mix sulfuric acid and hydrogen peroxide evenly, put the silicon chip into it and ultrasonically clean it for 35 minutes; mix and dissolve sodium hydroxide with 20 parts of deionized water, and Put the silicon wafer in it for ultrasonic cleaning for 7.5 minutes; mix 15 parts of hydrofluoric acid and the remaining deioni...
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Abstract
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