Silsesquioxane having hot melt extrusion forming capability, highly transparent and highly heat-resistant plastic transparent substrate using same, and method of manufacturing same

A technology of silsesquioxane and transparent substrates, which is applied in coatings and other directions, can solve the problems of small improvement, difficult application of substrates, and difficult application of plastic transparent substrates, etc., and achieve good light transmittance and less thermal deformation.

Active Publication Date: 2016-08-17
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For example, in Korean Patent Laid-Open No. 2012-0019136 (Patent Document 1), POSS (polyhedral oligomeric silsesquioxane) modified with terephthalic acid is added to PET to improve heat resistance, but the The improvement is not large, so it is difficult to apply to plastic transparent substrates
In Korean Patent Laid-Open No. 2013-0028626 (Patent Document 2), thermoplasticity is imparted by linking a side chain having a functional group capable of forming a hydrogen bond with the polysiloxane main chain, and can be mainly applied to insulatin

Method used

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  • Silsesquioxane having hot melt extrusion forming capability, highly transparent and highly heat-resistant plastic transparent substrate using same, and method of manufacturing same
  • Silsesquioxane having hot melt extrusion forming capability, highly transparent and highly heat-resistant plastic transparent substrate using same, and method of manufacturing same
  • Silsesquioxane having hot melt extrusion forming capability, highly transparent and highly heat-resistant plastic transparent substrate using same, and method of manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0093] Synthesis Example 1: Synthesis of Ladder Silsesquioxane Compounds

[0094] In a dry flask equipped with a cooling tube and a stirrer, add 15 parts by weight of distilled water, 85 parts by weight of methanol (purity 99.86%), 1 part by weight of potassium carbonate (purity 98%), epoxycyclohexylethyltrimethoxysilane (Shin-etsu, trade name KBM-303) 50 parts by weight, γ-methacryloxypropyltrimethoxysilane (DOW CORNING company, trade name DOW CORNING (R) Z-6030SILANE) 30 parts by weight and benzene 20 parts by weight of trimethoxysilane (DOW CORNING company, trade name DOW CORNING (R) Z-6124SILANE), slowly stirred for 8 hours under nitrogen atmosphere, then dropped into dichloromethane (purity 99.5%, Toyo Steel Chemical) 100 parts by weight, and further stirred for 2 hours.

[0095] The stirred liquid was washed several times with distilled water and classified to remove impurities, finally washed with methanol, and then the washed liquid was vacuum-dried at room temperatur...

Synthetic example 2

[0096] Synthesis example 2: the synthesis of clathrate silsesquioxane compound

[0097]*In a dry flask equipped with a cooling tube and a stirrer, add 10 parts by weight of distilled water, 85 parts by weight of methanol (purity 99.86%), 5 parts by weight of tetramethylammonium hydroxide (purity 25%), epoxycyclohexylethyl ether 50 parts by weight of propyltrimethoxysilane (Shin-etsu, trade name KBM-303), γ-methacryloxypropyl trimethoxysilane (DOW CORNING company, trade name DOW CORNING (R) Z-6030SILANE) 30 parts by weight and 20 parts by weight of methyltrimethoxysilane (DOW CORNING company, trade name DOW CORNING (R) Z-6300SILANE), slowly stirred for 6 hours under nitrogen atmosphere, then dropped into dichloromethane (purity 99.5%, Toyo Iron and Steel Chemicals) 200 parts by weight, and further stirred for 24 hours. Thereafter, a liquid clathrate silsesquioxane compound was obtained by the same method as in Synthesis Example 1 above.

Embodiment 1

[0100] Embodiment 1: the manufacture of the first substrate

[0101] The trapezoidal silsesquioxane compound synthesized in Synthesis Example 1 above was put into a mold, pressurized at 200°C for hot-melt molding, cooled, and solidified completely at 100°C for 2 hours and at 140°C for 1 Hours and 1 hour at 180° C. were cured step by step to finally produce a plastic transparent substrate with a thickness of 200 μm.

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Abstract

The present invention relates to silsesquioxane having hot melt extrusion forming capability, a highly transparent and highly heat-resistant plastic transparent substrate using same, and a method of manufacturing same and, more particularly, to a plastic transparent substrate capable of being formed through hot melt extrusion which is produced by sequentially hardening thermoplastic ladder-type silsesquioxane (having hot melt extrusion capability) through low-temperature thermosetting in stages, and to a multilayer plastic transparent substrate having good thermal and optical properties and manufactured by forming a separately produced thermosetting silsesquioxane coating layer on the surface of the substrate and sequentially hardening same. The plastic transparent substrate according to the present invention has little heat deformation under the processing temperatures used for existing display panels, is flexible, and has good light transmittance, so as to be used in various ways for liquid crystal displays, organic light emitting displays, substrates for flexible displays such as electronic paper, or as substrates for solar cells and secondary cells.

Description

technical field [0001] The present invention relates to a silsesquioxane capable of hot-melt extrusion molding, a highly transparent and high-heat-resistant plastic transparent substrate using the same, and a manufacturing method thereof. More specifically, it relates to a thermoplastic trapezoidal silsesquioxane capable of hot-melt extrusion A plastic transparent substrate that can be melt-extruded at high temperature and manufactured by siloxane sequentially curing at low temperature in stages, and a separately manufactured thermosetting silsesquioxane coating is formed on the surface of the above substrate and cured sequentially Multilayer plastic transparent substrate with excellent thermal and optical properties. Background technique [0002] As the most important component that determines the manufacturability, performance, reliability, and price of flexible displays, flexible transparent substrates are currently receiving great attention in the industry. In connectio...

Claims

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Application Information

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IPC IPC(8): C08G77/04C08G77/06C08J5/18C08J7/04B29C48/92C08J7/046
CPCC08G77/045C08G77/14C08G77/20C08J2333/12C08J2483/06C08K5/09C08J7/0427C08J7/046C08L83/06C08G77/16C08G77/18C08G77/06C08J5/18C08J7/05C08L83/04C09D183/04
Inventor 金斗植俞载元崔胜晳崔智殖吴星渊
Owner DONGJIN SEMICHEM CO LTD
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