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A kind of manufacturing method of electroplated diamond cutting wire

A technology for electroplating diamond and a manufacturing method, which is applied in electrolytic coatings, liquid chemical plating, metal material coating processes, etc. Actionable, easy-to-use effects

Inactive Publication Date: 2018-04-27
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method for manufacturing electroplated diamond cutting wires is that the chemically plated nickel-phosphorus alloy layer on the surface of the diamond particles has conductivity. A part of the cathode, which participates in the electrochemical reaction of the cathode and produces a discharge phenomenon
Although this method can reduce the agglomeration and uneven distribution of diamond particles to a certain extent, the addition of organic additives reduces the sanding efficiency and reduces the production efficiency of the electroplated diamond cutting line

Method used

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  • A kind of manufacturing method of electroplated diamond cutting wire
  • A kind of manufacturing method of electroplated diamond cutting wire
  • A kind of manufacturing method of electroplated diamond cutting wire

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Manufacture of electroplated diamond cutting wire with metal wire diameter of 0.10mm and diamond particle size of 8-12μm

[0039] A manufacturing method of electroplated diamond cutting wire, such as Figure 10 As shown, the steps are as follows:

[0040] The first step: electroless nickel-phosphorus alloy layer plating on the surface of diamond particles, that is: a nickel-phosphorus alloy layer is formed on the surface of diamond particles by electroless nickel plating, such as figure 1 shown;

[0041]The particle size of the diamond particles is 8-12 μm, and the weight gain of the nickel-phosphorus alloy layer is 60%. The weight gain of the nickel-phosphorus alloy layer refers to the ratio of the weight of the nickel-phosphorus alloy layer to the weight of the diamond particles; the nickel-phosphorus alloy layer The weight percent of the phosphorus content of layer is 7%; The method of electroless nickel phosphorus alloy layer is: nickel sulfate 20 grams / liter, sod...

Embodiment 2

[0055] Manufacture of electroplated diamond cutting wire with a metal wire diameter of 0.20 mm and a diamond particle size of 30-40 μm

[0056] A manufacturing method of electroplated diamond cutting wire, such as Figure 10 As shown, the steps are as follows:

[0057] The first step: electroless plating nickel-phosphorus alloy layer on the surface of diamond particles, that is: forming a nickel-phosphorus alloy layer on the surface of diamond particles by electroless nickel plating;

[0058] The particle size of the diamond particles is 30-40 μm, the weight gain of the nickel-phosphorus alloy layer is 30%, and the weight gain of the nickel-phosphorus alloy layer refers to the ratio of the weight of the nickel-phosphorus alloy layer to the weight of the diamond particles; the nickel-phosphorus alloy layer The weight percentage of phosphorus content is 9%; The method of electroless nickel phosphorus alloy layer is: Nickel sulfate: 20 grams / liter, sodium hypophosphite, 25 grams...

Embodiment 3

[0072] Manufacture of electroplated diamond cutting wire with metal wire diameter of 0.25mm and diamond particle size of 40-50μm

[0073] A manufacturing method of electroplated diamond cutting wire, such as Figure 10 As shown, the steps are as follows:

[0074] The first step: electroless plating nickel-phosphorus alloy layer on the surface of diamond particles, that is: forming a nickel-phosphorus alloy layer on the surface of diamond particles by electroless nickel plating;

[0075] The particle size of the diamond particles is 40-50 μm, the weight gain of the nickel-phosphorus alloy layer is 50%, and the weight gain of the nickel-phosphorus alloy layer refers to the ratio of the weight of the nickel-phosphorus alloy layer to the weight of the diamond particles; the nickel-phosphorus alloy layer The weight percent of phosphorus content is 8%; The method of electroless nickel phosphorus alloy layer is: Nickel sulfate: 20 grams / liter, sodium hypophosphite, 15 grams / liter, s...

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Abstract

The invention provides a manufacturing method of an electroplated diamond cutting wire and belongs to the technical field of electroplating. The manufacturing method comprises the steps that diamond particles of a surface chemical-plated nickel-phosphorus alloy layer are subjected to heat treatment, and map cracks are formed in the nickel-phosphorus alloy layer. According to the manufacturing method, the map cracks are formed in the nickel-phosphorus alloy layer on the surfaces of the diamond particles through heat treatment, and the point effect generated by the diamond particles solidified on a metal wire is restrained, so that the agglomeration phenomenon of the diamond particles on the metal wire is avoided, the distribution uniformity of the diamond particles is improved, and the quality of the electroplated diamond cutting wire is improved.

Description

technical field [0001] The invention relates to a method for manufacturing an electroplated diamond cutting wire, in particular to a method for manufacturing an electroplated diamond cutting wire by using diamond particles of a nickel-phosphorus alloy layer with reticular cracks on the surface, and belongs to the technical field of electroplating. Background technique [0002] Electroplated diamond cutting wire is a cutting tool made by consolidating diamond particles onto metal wires by electroplating. It is mainly used for cutting hard and brittle materials such as silicon crystals, sapphires, and ceramics. The general manufacturing process of electroplated diamond cutting wire mainly includes the following steps: pre-plating, sanding, and thickening. Among them, pre-plating refers to electroplating a layer of metal on the metal wire that has been degreased and derusted. Sanding refers to the preliminary consolidation of diamond particles on the metal wire by electroplati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D7/06C23C18/32
CPCC23C18/1639C23C18/1692C23C18/32C25D7/0607C25D15/00
Inventor 高伟曾骏董夫宁李腾
Owner QINGDAO UNIV OF SCI & TECH