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Turf-free substrate and application thereof

A substrate, peat technology, applied in application, planting substrate, medium and other directions, can solve problems such as environmental pollution, and achieve the effects of alleviating damage, reducing content, significant economic and ecological benefits

Active Publication Date: 2016-09-21
BEIJING AGRO BIOTECH RES CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the edible fungi are planted and harvested, waste medium or culture material will be produced. These waste medium are rich in fungal hyphae, water and pathogenic bacteria. If they are not disposed of in time, they will pollute the environment.
At present, reports on the use of various mushroom dregs to compound vegetable seedling substrates are limited to a few vegetable crops such as tomato and pepper.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation and application of embodiment 1 non-peat type matrix

[0022] Crush the fresh agaric bran, add water to adjust its water content to 50%, and then compost and ferment it. When the temperature in the center of the pile reaches 70°C, turn the pile until the center temperature of the pile is close to the ambient temperature, and obtain the cooked agaric bran. . Put the obtained Auricularia bran decompose into a high-pressure steam explosion device. After the steam pressure is 1MP and the steam temperature is 180°C, after 5 minutes of treatment, the pressure is reduced instantly; , and then mixed according to the volume percentage of 50% of fungus chaff, 25% of vermiculite and 25% of perlite by blasting to prepare the seedling raising substrate 1. Pepper seedlings (the variety is Nongda 24) were raised using the seedling-raising substrate, and the imported commercial seedling-raising substrate was used as a control. The emergence rate survey was carried out...

Embodiment 2

[0026] The preparation and application of embodiment 2 non-peat type matrix

[0027] Crush the fresh shiitake mushroom chaff, add water to adjust its water content to 60%, and then compost and ferment it. When the temperature in the center of the pile reaches 70°C, turn the pile until the center temperature of the pile is close to the ambient temperature to obtain the decomposed shiitake mushroom chaff. . Put the obtained shiitake chaff into a high-pressure steam explosion device, and treat it for 10 minutes at a steam pressure of 1MP and a steam temperature of 180°C, and then depressurize instantly; dry the exploded shiitake chaff , and then mixed according to the volume percentage of 50% of mushroom chaff, 25% of vermiculite and 25% of perlite according to blasting treatment, to prepare seedling raising substrate 2. Pepper seedlings (the variety is Nongda 24) were raised using the seedling-raising substrate, and the imported commercial seedling-raising substrate was used as...

Embodiment 3

[0031] The preparation and application of embodiment 3 non-peat type matrix

[0032] Crush the fresh shiitake mushroom chaff, add water to adjust its water content to 70%, and then compost and ferment it. When the temperature in the center of the pile reaches 70°C, turn the pile until the center temperature of the pile is close to the ambient temperature to obtain the decomposed shiitake mushroom chaff. . Put the obtained shiitake chaff into a high-pressure steam explosion device, and treat it for 15 minutes at a steam pressure of 1MP and a steam temperature of 200°C, and then depressurize instantly; dry the exploded shiitake chaff , and then mixed according to the volume percentage of 65% of mushroom chaff, 25% of vermiculite and 10% of perlite by blasting, to prepare the seedling raising substrate 3. Pepper seedlings (the variety is Nongda 24) were raised using the seedling-raising substrate, and the imported commercial seedling-raising substrate was used as a control. The...

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Abstract

The invention provides a turf-free substrate and application thereof. The turf-free substrate is made by mixing vermiculite, pearlite, and rotten fungus chaff which is processed by high pressure steam blasting. The turf-free substrate can be widely applied in seedling growing and cultivation of vegetable, fruit and flower. High pressure steam blasting is used to process fungus chaff which solves the problem of bad water preserving capability of fungus chaff substrate and realizes the resource utilization of fungus chaff, and therefore, the destructive effect of over-exploitation of turf resource on the environment is alleviated. The prepared turf-free substrate and application thereof has substantial economic benefit and ecological benefit.

Description

technical field [0001] The invention belongs to the technical field of resource utilization of agricultural production waste and the technical field of agricultural planting, and in particular relates to a peat-free substrate and its application. Background technique [0002] With the development of modern ecological agriculture, intensive and industrial seedling cultivation has gradually become an inevitable trend in the development of modern seedlings. Industrial seedling cultivation uses peat, vermiculite, perlite, etc. as seedling substrates, uses plug trays as seedling containers, and adopts mechanized precision seeding to achieve a modern seedling raising system that can grow seedlings at one time. Compared with conventional seedling raising, it has the advantages of short seedling raising period, neat and uniform seedling emergence, high seedling rate, labor saving, avoiding soil-borne diseases, easy standardization of seedling raising technology, factoryization, easy...

Claims

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Application Information

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IPC IPC(8): A01G9/10C05G1/00
CPCA01G24/00C05D9/00C05F5/00
Inventor 孙晓红韩梅琳夏琳王敏
Owner BEIJING AGRO BIOTECH RES CENT
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