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Silicon-boron tackifier and preparation method and application thereof

A tackifier, silicon boron technology, applied in the direction of adhesives, polymer adhesive additives, adhesive additives, etc., can solve the problems of poor bonding performance of LED substrates, increase cost and workload, etc., and achieve low risk. , The effect of improving adhesion and good anti-yellowing performance

Inactive Publication Date: 2016-10-12
广州双桃精细化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding performance of two-component silicone rubber to LED substrates is poor, and it is usually necessary to use a primer on the substrate to meet the bonding requirements, which undoubtedly increases the cost and workload.

Method used

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  • Silicon-boron tackifier and preparation method and application thereof
  • Silicon-boron tackifier and preparation method and application thereof

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Embodiment 1

[0036] A kind of embodiment of the preparation method of silicon boron tackifier described in the present invention, described preparation method comprises the following steps:

[0037](1) Preparation of epoxy-modified polysiloxane: Add 114.2g of allyl glycidyl ether and 100.0g of hydrogen-containing silicone oil to a 500ml three-necked flask. The hydrogen content of the hydrogen-containing silicone oil is 0.8%, 120ppm The chloroplatinic acid catalyst and 80.0 g of toluene solvent were reacted at 80° C. for 6 hours, and the low boilers were removed at 110° C. under low pressure to obtain epoxy-modified polysiloxane.

[0038] (2) Preparation of phenylpolysiloxane prepolymer: Add 104.0g ethyl orthosilicate, 198.0g phenyltrimethoxysilane, 558.0g divinyltetramethyldisiloxane to a 1000ml three-necked flask Alkanes and 150.0g toluene solvent, add 160.0g 1.0% sulfuric acid solution dropwise at 70°C, react for 4 hours and then heat up to 100°C for distillation until no fractions are d...

Embodiment 2

[0041] A kind of embodiment of the preparation method of silicon boron tackifier described in the present invention, described preparation method comprises the following steps:

[0042] (1) Preparation of epoxy-modified polysiloxane: Add 248.0g of 4-vinyl epoxycyclohexane and 110.0g of high hydrogen-containing silicone oil to a 500ml three-necked flask. The hydrogen content of the hydrogen-containing silicone oil is 1.6 %, 240ppm chloroplatinic acid catalyst and 160.0g toluene solvent were reacted at 85°C for 5 hours, and low boilers were removed at 110°C under low pressure to obtain epoxy-modified polysiloxane.

[0043] (2) Preparation of phenylpolysiloxane prepolymer: Add 104.0g ethyl orthosilicate, 198.0g phenyltrimethoxysilane, 558.0g divinyltetramethyldisiloxane to a 1000ml three-necked flask Alkanes and 150.0g toluene solvent, add 160.0g 1.0% sulfuric acid solution dropwise at 70°C, react for 4 hours and then heat up to 100°C for distillation until no fractions are disti...

Embodiment 3

[0046] A kind of embodiment of the preparation method of silicon boron tackifier described in the present invention, described preparation method comprises the following steps:

[0047] (1) Preparation of epoxy-modified polysiloxane: Add 114.2g of allyl glycidyl ether and 100.0g of hydrogen-containing silicone oil to a 500ml three-necked flask. The hydrogen content of the hydrogen-containing silicone oil is 0.8%, 120ppm The chloroplatinic acid catalyst and 80.0 g of toluene solvent were reacted at 80° C. for 6 hours, and the low boilers were removed at 110° C. under low pressure to obtain epoxy-modified polysiloxane.

[0048] (2) Preparation of phenylpolysiloxane prepolymer: add 122.2g of diphenyldimethoxysilane, 396.0g of phenyltrimethoxysilane, 184.0g of divinyltetramethyl in a 1000ml three-necked flask Disiloxane and 160.0g of toluene solvent, add 120.0g of 1.5% sulfuric acid solution dropwise at 80°C, heat up to 100°C for distillation after 4 hours of reaction, until no fr...

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Abstract

The invention discloses a silicon-boron tackifier. The silicon-boron tackifier has the following molecular structural formula: (R 1 Me 2 SiO 1 / 2 ) a (PhR 2 SiO 2 / 2 ) b (R 3 MeSiO 2 / 2 ) c (R 4 SiO 3 / 2 ) d (SiO 4 / 2 ) e (BO 3 / 3 ) f , wherein a+b+c+d+e+f=1; R in the molecular structural formula 1 is an unsaturated group, R 2 is an alkoxy group, methyl or phenyl, R 3 is the epoxy group, R 4 is phenyl or methyl. The invention also provides a preparation method of the silicon-boron tackifier and its application in two-component LED encapsulation glue. The silicon-boron tackifier of the present invention can be directly added to the LED packaging silica gel system to improve the adhesion between the LED packaging silica gel and the lamp beads, meet the requirements for sealing the lamp beads, and have high refractive index and good anti-yellowing properties. Change performance.

Description

technical field [0001] The invention relates to a tackifier, in particular to a silicon boron tackifier and its preparation method and application. Background technique [0002] LED is used more and more widely, and has the advantages of small size, low operating voltage, high safety factor, long life, energy saving and environmental protection, etc., and it is a direction for the development of light sources in the future. The performance of the encapsulant directly affects the performance and life of the LED, and the encapsulation material of the LED has been a hot research topic in recent years. The two-component silicone rubber material of organic silicon has the characteristics of good transparency, high refractive index, good thermal stability, small stress cracking, and good water resistance. It has become an excellent raw material for LED packaging adhesives. [0003] Two-component LED silicone encapsulant refers to the silicone rubber obtained by cross-linking and ...

Claims

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Application Information

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IPC IPC(8): C08G77/56C08G77/44C08G77/38C08G77/20C09J183/07C09J183/05C09J183/14C09J11/08H01L33/56
CPCC08G77/56C08G77/20C08G77/38C08G77/44C08L2203/206C08L2205/02C08L2205/025C08L2205/035C09J11/08C09J183/04H01L33/56
Inventor 熊天宝唐强叶文波熊满军
Owner 广州双桃精细化工有限公司
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