Chip high voltage ceramic dielectric capacitor

A technology of high-voltage ceramics and capacitors, applied in the field of capacitors, can solve the problems of complex process equipment and technology, high industrialization cost, and high sales price, and achieve the effect of large bonding area, large welding area, and firm fixation

Active Publication Date: 2016-10-12
WUJIANG JIA BILLION ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chip multilayer ceramic capacitors can meet the needs of SMT mounting production. For example, chip multilayer ceramic capacitors with ceramic films superimposed into sheets and coated with external electrode structures at both ends can be made into high-voltage large-capacity capacitors. , there are certain difficulties in making capacitors with smaller capacities, and its process equipment and technology are much more complicated, resulting in high industrialization costs and high sales prices

Method used

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  • Chip high voltage ceramic dielectric capacitor

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Embodiment Construction

[0020] The present application will be further described in detail below in conjunction with the accompanying drawings and specific preferred embodiments.

[0021] like figure 1 As shown, a chip-type high-voltage ceramic capacitor, which has a ceramic silver plate 1, a first electrode 11, a second electrode 12, a plastic case 2, a lead groove 21, an electrode horizontal groove 211, a vertical groove 212, and an open horizontal groove 213, metal lead-out wire 3, horizontal welding portion 31, vertical bending portion 32, horizontal bonding portion 33, removable component 34 and liquid insulating sealant 4 and other main technical features.

[0022] A chip-type high-voltage ceramic dielectric capacitor includes a silver ceramic chip, a plastic case, a metal lead-out wire and an insulating sealant.

[0023] The arrangement of the above-mentioned silver ceramic sheets can make the high-voltage chip capacitors into a monolithic shape, the structure is simple, the production proces...

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Abstract

The invention discloses a chip high voltage ceramic dielectric capacitor, which comprises a silver-plated ceramic chip, a plastic case, metal outgoing wires and an insulated sealant, wherein the section of each metal outgoing wire is long strip-shaped; each metal outgoing wire is U-type on the whole; each metal outgoing wire comprises a transverse welding part, a vertical bending part and a transverse fitting part; the transverse welding part is used for being welded with a first electrode or a second electrode; the transverse fitting part is used for being electrically connected with a to-be-mounted device; the vertical bending part is used for being connected with the transverse welding part and the transverse fitting part; a removable assembly is arranged on the transverse fitting part located at the outer side of the plastic shell; and a lead groove is filled with the liquid-shaped insulated sealant capable of being cured. After the above structure is adopted, a single chip shape can be made, the appearance is regular, the chip high voltage ceramic dielectric capacitor can be directly mounted on a circuit board, insertion like a wafer ceramic dielectric capacitor is not needed, and high-efficiency SMT mounting production can be better met.

Description

technical field [0001] The application relates to a capacitor, in particular to a chip type high voltage ceramic capacitor. Background technique [0002] The high-voltage ceramic capacitors currently produced include disc high-voltage ceramic capacitors and chip multilayer ceramic capacitors. The disc high-voltage ceramic capacitor is a traditional structure. Two thin long leads are welded on the ceramic silver plate, and the surface is covered with a layer of epoxy resin. The installed circuit board has two small holes for the capacitor to be inserted. This type of installation has poor manufacturability, cannot withstand high mechanical vibration or shock, and due to the lead inductance, the upper limit of the operating frequency is limited. In order to adapt to the development trend of miniaturization and thinning, it has become an irresistible trend to change the structure of electronic components from the traditional plug-in type to the SMT mount type. Chip multilayer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/228
CPCH01G4/12H01G4/228H01G4/30
Inventor 陆全明
Owner WUJIANG JIA BILLION ELECTRONICS TECH
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