Sapphire crystal etching and polishing compound machine tool

A sapphire wafer, composite processing technology, applied in surface polishing machine tools, grinding machine tools, metal processing equipment and other directions, can solve problems such as damage and low polishing efficiency, achieve compact machine tool structure, improve processing efficiency, and facilitate loading and unloading. the effect of

Active Publication Date: 2016-10-26
HUAQIAO UNIVERSITY +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If a finer-grained abrasive is used for precision polishing, the polishing efficiency is very low, b

Method used

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  • Sapphire crystal etching and polishing compound machine tool
  • Sapphire crystal etching and polishing compound machine tool
  • Sapphire crystal etching and polishing compound machine tool

Examples

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Embodiment Construction

[0030] Please check figure 1 , Sapphire wafer A corrosion and polishing compound processing machine tool, including a machine 1, a vertical rotating arm 6, a spindle system 9, a first motor 8, a loading tray 10 and a negative pressure mechanism. The object tray 10 is provided with a suction hole, and the negative pressure mechanism is connected to the suction hole to make the object tray 10 absorb the wafer through the negative pressure, release the wafer through the negative pressure, and preferably, the number of the suction holes is multiple And arranged according to the rules.

[0031] The top surface of the machine platform 1 is provided with a loading and unloading station 2, a rough throwing station 3, a corrosion station 4 and a fine throwing station 5 arranged at intervals in the circumferential direction. Position 3, corrosion position 4 and fine polishing position 5 are arranged in a circular array.

[0032] The vertical rotating arm 6 is arranged at the axis of t...

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PUM

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Abstract

The invention discloses a sapphire crystal etching and polishing compound machine tool. The machine tool comprises a stand, a vertical rotating arm, a main shaft system, a motor, a carrying disc and a negative pressure mechanism; a loading/unloading station, a rough polishing station, an etching station and a finish polishing station are peripherally arranged on the top surface of the stand at intervals; a cantilever is fixed at the upper part of the vertical rotating arm; the main shaft system can move up and down corresponding to the cantilever; the motor and the carrying disc are both connected to the main shaft system, and the motor is in transmission connection with the carrying disc to drive the carrying disc to rotate; a sucking hole is formed in the carrying disc; the negative pressure mechanism is communicated with the sucking hole; the vertical rotating arm is arranged on the axis in the peripheral direction, and can rotate around the axis; and the vertical rotating arm rotates to respectively shift the carrying disc to the loading/unloading station, the rough polishing station, the etching station and the finish polishing station for corresponding processing. The machine tool has the following advantages: the machine tool can perform the loading, etching, polishing and unloading compound processing for sapphire crystals, can quickly obtain ultrasmooth crystal surfaces without damage, and greatly improves the processing efficiency of the sapphire crystals.

Description

technical field [0001] The invention relates to the field of semiconductor material processing, in particular to a sapphire wafer corrosion-polishing compound processing machine tool. Background technique [0002] Sapphire is widely used in high-speed integrated circuits and laser chips because of its excellent characteristics such as high temperature resistance, wear resistance, good thermal conductivity, excellent electrical insulation, stable chemical properties, high hardness and high strength, and a wide light transmission band. Communications, LEDs, high-speed missile fairings, mobile phone screens, optical components, medical sapphire blades, high-temperature and high-strength structural components and other military and civilian fields. In these applications, precision or even ultra-precision processing is required on the surface of sapphire parts, especially when sapphire is used as the LED substrate and window material, the surface of the workpiece is required to b...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B27/00B24B41/06B24B41/00B24B37/04B24B37/27B24B37/34
CPCB24B27/0023B24B29/02B24B37/04B24B37/27B24B37/34B24B41/005B24B41/06
Inventor 方从富徐西鹏胡中伟赵欢谢斌晖陈铭欣
Owner HUAQIAO UNIVERSITY
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