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Composite additive for cyanide-free electroplating copper and production technology of cyanide-free electroplating copper

A composite additive and electroplating copper technology, which is applied in the field of composite additives, can solve problems such as low current efficiency of copper plating in cyanide solution, hidden dangers to the environment and personnel safety, and toxicity, etc., and achieve a flat surface without dendrite growth, fine crystallization, and brightness. good binding effect

Inactive Publication Date: 2016-11-02
TAIYUAN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current efficiency of copper plating in cyanide solution is relatively low and drops sharply with the increase of current density
In addition, cyanide solution can also interact with CO in the air 2 Cyanide carbonation occurs, and toxic HCN is produced at the same time, which is not stable enough
At the same time, cyanide, as a highly toxic drug, may cause great safety hazards to the environment and personnel during production, transportation and use.
Because the current cyanide-free copper plating process has certain defects in the plating solution, coating and process, it is particularly necessary to carry out in-depth research on the cyanide-free copper plating system, to find a non-toxic, environmentally friendly electroplating process, and reduce the impact on humans. Harmful to the environment and the environment, the implementation of a green electroplating industry is a must-solve research topic for current electroplating workers

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The production process of the cyanide-free electroplating copper plating of this embodiment is to first prepare the electroplating solution, then pre-treat the plated parts, then electroplate the plated parts, and finally undergo post-treatment of the plated parts. Its specific operation process is as follows:

[0033] Step 1. Prepare the plating solution

[0034] Weigh the required amount of 0.05mol / L copper chloride and 0.5mol / L potassium chloride, and dissolve them in deionized water accounting for about 3 / 4 of the total volume. Then add 0.1 mol / L potassium hydrogen tartrate and 0.05 g / L triethanolamine. Finally, use a high-concentration KOH solution to adjust the pH to about 10.5, stir continuously to dissolve all the drugs, then add deionized water to the required volume, and use a low-concentration KOH solution to fine-tune the pH to 10.5.

[0035] Step 2. Pretreatment of plated parts

[0036] Plated parts are polished and derusted with 400 mesh, 600 mesh, and ...

Embodiment 2

[0043] The production process of the cyanide-free electroplating copper plating of this embodiment is to first prepare the electroplating solution, then pre-treat the plated parts, then electroplate the plated parts, and finally undergo post-treatment of the plated parts. Its specific operation process is as follows:

[0044] Step 1. Prepare the plating solution

[0045] Weigh the required amount of 0.5mol / L copper chloride and 3.0mol / L sodium chloride, and dissolve them in deionized water accounting for about 3 / 4 of the total volume. Then add 0.3 mol / L sodium citrate, 0.02 g / L diethylenetriamine, 0.03 g / L thiourea, and 0.1 g / L polyethylene glycol-6000 (P). Finally, use a high-concentration NaOH solution to adjust the pH to about 10.0, stir continuously to dissolve all the drugs, then add deionized water to the required volume, and use a low-concentration NaOH solution to fine-tune the pH to 10.0.

[0046] Step 2. Pretreatment of plated parts

[0047] Plated parts are polis...

Embodiment 3

[0054] The production process of the cyanide-free electroplating copper plating of this embodiment is to first prepare the electroplating solution, then pre-treat the plated parts, then electroplate the plated parts, and finally undergo post-treatment of the plated parts. The specific operation process is as follows:

[0055] Step 1. Prepare the plating solution

[0056] Weigh the required amount of 0.15mol / L copper sulfate, 0.5mol / L potassium sulfate, and 1.0mol / L sodium sulfate, and dissolve them in deionized water accounting for about 3 / 4 of the total volume. Then add 0.6 mol / L potassium sodium tartrate, 0.02 g / L hexamethylenetetramine, and 0.08 g / L 2-thiouracil. Finally, use high-concentration ammonia water to adjust the pH to about 9.5, stir continuously to dissolve all the drugs, then add deionized water to the required volume, and use low-concentration ammonia water to fine-tune the pH to 9.5.

[0057] Step 2. Pretreatment of plated parts

[0058] Plated parts can be...

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Abstract

The invention provides a composite additive for cyanide-free electroplating copper. The composite additive is characterized by comprising a main complex compound, a surfactant and a pH conditioning agent. The invention further discloses a production technology for preparing the electroplating copper through the composite additive. An electroplating system is free of cyanide and poison and environmentally friendly; the binding force of an electroplating copper layer prepared through the electroplating system and a base body is good; and the surface of the electroplating copper layer is smooth and free of dendritic growth, crystals are delicate and bright, and the purity degree of the electroplating copper layer is larger than or equal to 99.0%. The electroplating copper is obtained by using the composite additive, the electroplating system is stable, the processing technology is simple, and the processing cost is low.

Description

technical field [0001] The invention relates to a composite additive used in copper electroplating in a cyanide-free electroplating system and a copper electroplating process using the additive, belonging to the technical field of electroplating processes. Background technique [0002] Electroplating is a surface engineering technology for decorating, protecting and obtaining some special properties on the surface of the substrate. Electroplating technology is a technology that can change the surface properties of materials. It is usually applied to metal surface protection, decoration or to achieve other special functions. It is also an important part of surface treatment. [0003] Cyanide copper plating has been widely used in the entire electroplating industry. Cyanide is a kind of inorganic compound with super strong complexing ability and surface activity. It is mainly obtained by using the super strong complexing ability of CN- ions and most metal ions to improve the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 丁莉峰牛宇岚刘艳军李松栋赵辉姚英赵晓红李冰刘波
Owner TAIYUAN INST OF TECH
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