Substrate with surface nano porous silver and preparation method and application thereof
A nanoporous silver and matrix technology, applied in the field of sensors, can solve the problems of large thickness, large limitations, and limited sensor applications, and achieve the effects of high efficiency, increased response, and improved sensitivity
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Embodiment 1
[0033] This embodiment provides a substrate with nanoporous silver on the surface, the substrate 1 is provided with a conductive layer 3 on the surface; the substrate is nickel foam; and the conductive layer is nanoporous silver.
[0034] Reaction holes are set in the conductive layer; the reaction holes communicate with each other. The diameter of the reaction hole is 70nm; the surface porosity of the conductive layer is 35%. The thickness of the conductive layer is 10 μm.
[0035] The thickness of the substrate is 0.1mm.
[0036] The surface resistivity value of the substrate provided with nanoporous silver at 25°C is 2.17×10 -8 Ω·m.
Embodiment 2
[0038] This embodiment provides a substrate with nanoporous silver on the surface, the substrate 1 surface is provided with a buffer layer 2; the buffer layer 2 surface is provided with a conductive layer 3; the substrate is alumina ceramics; the conductive layer for nanoporous silver.
[0039]Reaction holes are set in the conductive layer; the reaction holes communicate with each other. The diameter of the reaction hole is 80nm; the surface porosity of the conductive layer is 40%. The thickness of the conductive layer is 10 μm.
[0040] The buffer layer is an alloy layer formed of Mo / W (the mass ratio of Mo and W is 1:1); the thickness of the substrate is 0.48 mm, and the thickness of the buffer layer is 15 μm.
[0041] The surface resistivity value of the substrate provided with nanoporous silver at 25°C is 1.99×10 -8 Ω·m.
Embodiment 3
[0043] This embodiment provides a substrate with nanoporous silver on the surface, the substrate 1 is provided with a conductive layer 3 on the surface; the substrate is metallic copper; and the conductive layer is nanoporous silver.
[0044] Reaction holes are set in the conductive layer; the reaction holes communicate with each other. The diameter of the reaction hole is 60nm; the surface porosity of the conductive layer is 30%. The thickness of the conductive layer is 10 μm.
[0045] The thickness of the substrate is 0.48 mm.
[0046] The surface resistivity value of the substrate provided with nanoporous silver at 25°C is 2.13×10 -8 Ω·m.
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Abstract
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