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A kind of low-temperature curing conductive paste based on flexible substrate and preparation method thereof

A technology of conductive paste and flexible substrate, which is used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. Too ideal and other problems, to achieve the effects of excellent printing characteristics and firing characteristics, satisfying capacity, and reducing manufacturing costs

Inactive Publication Date: 2018-04-24
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, base metals are also used to replace some precious metals as the functional phase of the conductive paste, but the conductive performance, printability, adhesion and other properties of the prepared conductive paste are not ideal.

Method used

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  • A kind of low-temperature curing conductive paste based on flexible substrate and preparation method thereof
  • A kind of low-temperature curing conductive paste based on flexible substrate and preparation method thereof
  • A kind of low-temperature curing conductive paste based on flexible substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A low-temperature curing conductive paste based on flexible substrates, in weight percent, comprises the following components:

[0033] Composite functional phase 60%,

[0034] Organic vehicle 40%;

[0035] The composite functional phase, by weight percentage, includes the following components:

[0036] Nano spherical silver powder 40%,

[0037] Nano flake nickel powder 60%;

[0038] Described organic carrier, by weight percentage, comprises following components:

[0039]

[0040] The flexible substrate is PET film;

[0041] Its preparation method comprises the following steps:

[0042] (1) Prepare composite functional phase: mix nano-spherical silver powder and nano-flaky nickel powder evenly to prepare mixed functional phase;

[0043] (2) Preparation of organic vehicle: Dissolve N,N-dimethylformamide, self-curing epoxy resin, polymethacrylic acid amine, polyether modified silicone, and polyamide wax in a water bath at 80°C to obtain an organic carrier, and b...

Embodiment 2

[0046] A low-temperature curing conductive paste based on flexible substrates, in weight percent, comprises the following components:

[0047] Composite functional phase 70%,

[0048] Organic vehicle 30%;

[0049] The composite functional phase, by weight percentage, includes the following components:

[0050] Nano spherical silver powder 50%,

[0051] Nano flake nickel powder 50%;

[0052] Described organic carrier, by weight percentage, comprises following components:

[0053]

[0054] The flexible substrate is PBT;

[0055] Its preparation method comprises the following steps:

[0056] (1) Prepare composite functional phase: mix nano-spherical silver powder and nano-flaky nickel powder evenly to prepare mixed functional phase;

[0057] (2) Preparation of organic vehicle: Dissolve N,N-dimethylacetamide, self-curing polyurethane resin, polymethacrylic acid amine, polydimethylsiloxane, and polyamide wax in a water bath at 80°C to obtain organic carrier, and by adjust...

Embodiment 3

[0060]A low-temperature curing conductive paste based on flexible substrates, in weight percent, comprises the following components:

[0061] Composite functional phase 65%,

[0062] Organic vehicle 35%;

[0063] The composite functional phase, by weight percentage, includes the following components:

[0064] Nano spherical silver powder 55%,

[0065] Nano flake nickel powder 45%;

[0066] Described organic carrier, by weight percentage, comprises following components:

[0067]

[0068] The flexible substrate is PI film;

[0069] Its preparation method comprises the following steps:

[0070] (1) Prepare composite functional phase: mix nano-spherical silver powder and nano-flaky nickel powder evenly to prepare mixed functional phase;

[0071] (2) Preparation of organic vehicle: Dissolve N-methylpyrrolidone, self-curing phenolic resin, 1,4-dihydroxysulfonate amine, polyether modified silicone, and polyamide wax in a water bath at 80°C to obtain an organic vehicle , and...

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Abstract

The invention discloses a flexible base material-based low-temperature curing conductive paste. The conductive paste comprises a composite functional phase and an organic carrier, wherein the composite functional phase is mixed powder of nano spherical silver powder and nano flaky nickel powder, and the organic carrier is a mixture of an organic solvent, a self-curable polymer resin, a dispersant, an antifoaming agent and a thixotropic agent. The invention also discloses a preparation method of the low-temperature curing conductive paste. The conductive paste prepared by using the preparation method of the invention has the advantages of low cost, good conductive property, strong adhesion, excellent printing characteristic, excellent sintering characteristic and excellent environmental protection performance, and is matched with a flexible base material.

Description

Technical field: [0001] The invention relates to the technical field of electronic materials, in particular to a low-temperature curing conductive paste based on a flexible substrate. Background technique: [0002] Conductive paste is the key material for packaging, electrodes and interconnection of electronic components, mainly including two types of infiltration conductive paste and curable conductive adhesive. According to the different fillers, the conductive paste can be divided into carbon paste (graphite conductor), metal paste (gold powder, silver powder, copper powder, silver-copper alloy), and modified ceramic paste. According to the classification of curing conditions, it can be divided into heat curing, UV curing and so on. The traditional burn-in type conductive paste contains a large amount of lead, which is not conducive to environmental protection. The currently used conductive adhesive often contains some harmful substances, and the cost is relatively high....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 高丽萍苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD