Film radiant heat flow sensor and manufacturing method thereof

A heat flow sensor and thin film technology, applied in the field of thin film special sensors, can solve the problems of complex structure, large volume, slow response speed, etc., and achieve the effects of improving processing efficiency, reducing manufacturing cost and improving measurement accuracy.

Inactive Publication Date: 2016-11-16
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
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Problems solved by technology

The round foil heat flow sensor is the most widely used, characterized by rapid response, wide measurement range, and long working time, but the disadvantage is that it is bulky and not suitable for some small spaces
The plug heat flow sensor is generally used to measure the full heat flow environment, but because of its complex structure, it is not as widely used as the round foil type, and the re

Method used

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  • Film radiant heat flow sensor and manufacturing method thereof
  • Film radiant heat flow sensor and manufacturing method thereof

Examples

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preparation example Construction

[0021] The preparation method of the above-mentioned thin film radiation heat flow sensor comprises the following steps:

[0022] (1) Ultrasonic cleaning of the substrate with acetone for 10 minutes, ultrasonic cleaning of the substrate with absolute ethanol for 10 minutes, and ultrasonic cleaning of the substrate with deionized water for 10 minutes to remove surface oil and impurities;

[0023] (2) Put the substrate on the vacuum chuck of the glue leveling machine, evenly coat the photoresist, and bake the photoresist with a heating platform to evaporate a certain amount of solution;

[0024] (3) Put the substrate and the glass mask plate on the planet carrier of the photolithography machine for photolithography, prepare the photolithographic pattern of the A electrode 9, put it into the heating platform again and bake to make the photoresist further evaporate a certain amount of solution;

[0025] (4) Put the substrate into the sample platform of the coating machine, deposit...

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Abstract

The invention discloses a film radiant heat flow sensor and a manufacturing method thereof. The film radiant heat flow sensor comprises a foundation 1, a film thermocouple array 2 arranged on the foundation 1 and thermal resistance layers 3 arranged on the film thermocouple array 2, wherein the film thermocouple array 2 comprises more than two film thermocouples which are connected in series through outer connection points 11, the film thermocouple comprises an A electrode 9 and a B electrode 10 which are connected, two adjacent outer connection points 11 are provided with the thermal resistance layers 3, and two external connection ends of the film thermocouple array 2 are respectively connected with compensation leads 14 corresponding to respective electrodes through a bonding pad 13. The film radiant heat flow sensor employs the mature process and materials in the prior art, the production process is simple, cost is low, and the film radiant heat flow sensor further has property of excellent measurement precision.

Description

technical field [0001] The invention belongs to the technical field of thin-film special sensors, and in particular relates to a thin-film sensor based on coating technology and photolithography technology and a preparation method thereof. Background technique [0002] In the process of science and technology, industrial production, and engineering construction, heat flow is transferred in various ways, and the three most common transfer methods are heat conduction, convection and radiation. With the development of modern science and technology, the measurement technology of heat flux has attracted more and more attention. In the field of thermal analysis and monitoring, the necessity of heat flux measurement has been emphasized and confirmed, and the corresponding heat flow measurement methods have been greatly developed and widely used. In terms of radiation heat flux measurement, many new sensors have been developed abroad, and the development of new materials and the pr...

Claims

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Application Information

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IPC IPC(8): G01J5/12
CPCG01J5/12G01J2005/123
Inventor 韩玉阁任立飞
Owner NANJING UNIV OF SCI & TECH
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