Film radiant heat flow sensor and manufacturing method thereof

Abstract

The invention discloses a film radiant heat flow sensor and a manufacturing method thereof. The film radiant heat flow sensor comprises a foundation 1, a film thermocouple array 2 arranged on the foundation 1 and thermal resistance layers 3 arranged on the film thermocouple array 2, wherein the film thermocouple array 2 comprises more than two film thermocouples which are connected in series through outer connection points 11, the film thermocouple comprises an A electrode 9 and a B electrode 10 which are connected, two adjacent outer connection points 11 are provided with the thermal resistance layers 3, and two external connection ends of the film thermocouple array 2 are respectively connected with compensation leads 14 corresponding to respective electrodes through a bonding pad 13. The film radiant heat flow sensor employs the mature process and materials in the prior art, the production process is simple, cost is low, and the film radiant heat flow sensor further has property of excellent measurement precision.

Description

technical field [0001] The invention belongs to the technical field of thin-film special sensors, and in particular relates to a thin-film sensor based on coating technology and photolithography technology and a preparation method thereof. Background technique [0002] In the process of science and technology, industrial production, and engineering construction, heat flow is transferred in various ways, and the three most common transfer methods are heat conduction, convection and radiation. With the development of modern science and technology, the measurement technology of heat flux has attracted more and more attention. In the field of thermal analysis and monitoring, the necessity of heat flux measurement has been emphasized and confirmed, and the corresponding heat flow measurement methods have been greatly developed and widely used. In terms of radiation heat flux measurement, many new sensors have been developed abroad, and the development of new materials and the pr...

AI Technical Summary

Problems solved by technology

The round foil heat flow sensor is the most widely used, characterized by rapid response, wide measurement range, and long working time, but the disadvantage is that it is bulky and not suitable for some small spaces

The plug heat flow sensor is generally used to measure the full heat flow environment, but because of its complex structure, it is not as widely used as the round foil type, and the response speed is slow

The overall structure and manufacturing process of the metal block heat flow sensor are relatively simple. The disadvantage is that it cannot be measured for a long time in some occasions, and the output signal is not proportional to the loaded radiation heat flow. It needs to be equipped with a computing module, which is not conducive to the simplified design of the equipment.

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