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Heat dissipation film, dispersion liquid for heat emission layer, method for producing heat dissipation film and solar cell

A technology of a heat radiation layer and a manufacturing method, applied in the field of solar cells, can solve the problems of inability to maintain electrical insulation, easy peeling, poor adhesion of metal films, etc.

Inactive Publication Date: 2016-11-30
SUMITOMO SEIKA CHEM CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation films disclosed in Patent Documents 2 and 3 use silicone resin as an inorganic binder in the heat radiation layer, but the heat radiation layer using silicone resin has low heat resistance and is not compatible with the The problem that the adhesion of the metal film of the layer is poor and it is easy to peel off
The heat dissipation film disclosed in Patent Document 4 uses powdered graphite instead of inorganic substances as the filler of the heat radiation layer. By setting the relationship between the average particle size and the film thickness, the heat dissipation is excellent, and the adhesion to the heat transfer layer is good. However, when the resin is highly filled with graphite to improve heat dissipation, there is a problem that electrical insulation cannot be maintained.

Method used

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  • Heat dissipation film, dispersion liquid for heat emission layer, method for producing heat dissipation film and solar cell
  • Heat dissipation film, dispersion liquid for heat emission layer, method for producing heat dissipation film and solar cell
  • Heat dissipation film, dispersion liquid for heat emission layer, method for producing heat dissipation film and solar cell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150] (Synthesis of polyamic acid varnish)

[0151] Put 140.1 g (0.70 mol) of 4,4-diaminodiphenyl ether and 1433.3 g of N-methyl-2-pyrrolidone into a 2-liter capacity reaction vessel equipped with a stirrer and a thermometer, and dissolve it at 30°C to 40°C . Next, while maintaining the temperature at 45°C to 50°C, 72.5 g (0.33 moles) of pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid were added to the reaction vessel over 40 minutes. 97.8 g (0.33 mol) of dianhydride. After stirring at the same temperature for 60 minutes, 183.3 g (0.02 mol) of a solution of 2.4% by weight of pyromellitic dianhydride in N-methyl-2-pyrrolidone was added to adjust the viscosity, and 4.2% by weight of phthalo The reaction was stopped with 7.5 g (0.002 mol) of N-methyl-2-pyrrolidone solution of an acid anhydride to obtain 1933.9 g of a polyamic acid varnish with a concentration of 16.3% and a viscosity of 6.2 Pa·s.

[0152] (Manufacture of dispersion liquid for heat radiatio...

Embodiment 2

[0157] In "(Manufacture of Dispersion Liquid for Heat Radiation Layer)", talc was obtained in the same manner as in Example 1, except that the compounded amount of talc was 36.0 g, and 22.8 g of N-methyl-2-pyrrolidone was further added. A uniform dispersion liquid for a heat radiation layer having a ratio of 90.0% by weight relative to the entire non-volatile component and a ratio of 48.0% by weight of the non-volatile component relative to the entire dispersion liquid.

[0158] Using the dispersion liquid for the heat radiation layer obtained, the depth of the groove is used as a bar coater of 100 μm, except that, in the same manner as in Example 1, a water-insoluble inorganic compound ( Talc) is a heat dissipation film of a heat radiation layer having a content of 90.0% by weight relative to the entire heat radiation layer and a thickness of 57.6 μm.

Embodiment 3

[0160]In "(Manufacture of dispersion liquid for heat radiation layers)", except that the compounding quantity of talc was 1.7g, it obtained the ratio of talc with respect to the whole non-volatile component as 30.0 weight% and The ratio of the non-volatile component to the whole dispersion liquid was 21.8 weight% and the uniform dispersion liquid for heat radiation layers.

[0161] The obtained dispersion liquid for the heat radiation layer was dried in a forced-air oven at 90°C for 30 minutes using a bar coater with a groove depth of 200 μm to remove the dispersion medium, and then further used with a groove depth of 150 μm. except that the bar coater was used to coat the coating surface, and a water-insoluble inorganic compound (talc) composed of talc and polyimide resin was obtained in the same manner as in Example 1 for the entire heat radiation layer. A heat dissipation film of a heat radiation layer having a content of 30.0% by weight and a thickness of 43.6 μm.

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Abstract

Provided is a heat dissipation film that is obtained by laminating a heat emission layer, which has excellent heat dissipation properties by means of infrared light emission, excellent electrical insulation properties and excellent heat resistance, on a metal film having excellent heat conductivity. This heat dissipation film has high mechanical strength and flexibility. Also provided are: a dispersion liquid for heat emission layers, which is used for the production of this heat dissipation film; a method for producing a heat dissipation film using this dispersion liquid for heat emission layers; and a solar cell which uses this heat dissipation film. A heat dissipation film which comprises a heat conduction layer and a flexible heat emission layer that is laminated on the heat conduction layer. The heat conduction layer is a metal film, and the heat emission layer contains a water-insoluble inorganic compound and a heat-resistant synthetic resin. The content of the water-insoluble inorganic compound in the heat emission layer is 30-90% by weight relative to the whole heat emission layer. The heat emission layer has a thermal emissivity of 0.8 or more and a dielectric breakdown strength of 10 kV / mm or more.

Description

technical field [0001] The present invention relates to a heat dissipation film for dissipating heat generated by IC chips, LEDs, etc. built in electronic equipment. In addition, the present invention relates to a dispersion liquid for a heat radiation layer for producing the heat radiation film, a method for producing a heat radiation film using the dispersion liquid for a heat radiation layer, and a solar cell using the heat radiation film. Background technique [0002] In recent years, as the shape of electronic equipment has become smaller, lighter, and thinner, the demand for multifunctional and high-function IC chips built in electronic equipment is also increasing, and the integration level of circuits is also increasing. . These IC chips generate heat due to leakage current, dynamic power, or resistance of wires during operation. If the amount of heat generated by the IC chip increases due to the high integration of the circuit, the semiconductor may be destroyed, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B05D7/14B05D7/24C09D7/12H01L23/373
CPCH01L23/373H01L23/3731H01L23/3736H01L2924/0002Y02E10/50H01L2924/00H01L23/3737F28F13/18F28F21/04F28F21/06F28F21/084F28F2270/00H01L23/3735H01L31/052H01L33/641
Inventor 梅田雄纪坂东诚二川崎加瑞范加藤俊彦蛯名武雄林拓道中村考志太田明内藤贵
Owner SUMITOMO SEIKA CHEM CO LTD