Low-dielectric POSS type epoxy resin composite and preparation method thereof

Abstract

The invention provides a low-dielectric POSS type epoxy resin composite and a preparation method thereof, and relates to the field of high molecular polymer materials. The low-dielectric POSS type epoxy resin composite comprises 100 parts of POSS type epoxy resin, 4-40 parts of a curing agent and 5 parts of additives. The composite disclosed by the invention introduces the additives, such as POSS monomers with low dielectric constants by synthesizing the POSS type epoxy resin and modifying the POSS type epoxy resin, so that the dielectric constant of the composite can be notably reduced, the hydrophilicity of the composite is reduced, the heat stability of the composite is improved, and the low-dielectric POSS type epoxy resin composite is suitable for various fields of electronic packaging and the like. The preparation method of the composite is simple, and convenient and quick to operate, and has excellent development and application prospects.

Description

technical field [0001] The invention relates to the field of high molecular polymer materials. Background technique [0002] With the rapid development of the electronics and microelectronics industry, while the functions of microelectronic components are continuously enhanced, the volume is constantly shrinking, so the density of its internal components is gradually increasing, which will lead to signal transmission delays, crosstalk noise enhancement, etc. Among them, the signal delay is more serious. In order to speed up the signal transmission speed, reduce signal interference and inductive coupling, it is urgent to use low dielectric constant materials. [0003] At present, the printed circuit board substrate resins commonly used in the industry include epoxy resin, cyanate resin, polytetrafluoroethylene, polyimide resin, etc. Modification of plastics, rubber elastomers, and compounds containing unsaturated double bonds. The main problems in the application of cyanate...

AI Technical Summary

Problems solved by technology

The main problems in the application of cyanate ester resins in the industry include long curing time, high curing reaction temperature, high cost, and very brittle cured products

Although PTFE has excellent dielectric properties, it has the following disadvantages that are difficult to overcome: poor processability, poor bonding performance, and high cost

However, with the rapid development of the microelectronics industry in recent years, the dielectric properties of general epoxy resins cannot meet the requirements of today's low dielectric materials. Therefore, the main problem to be solved at present is to reduce the dielectric constant of epoxy resin matrix materials.

[0004] At present, the methods for reducing the dielectric constant of epoxy resin mainly include: one is to adopt the method of blending or co-curing with other resins to reduce the dielectric constant of epoxy resin, such as co-processing with polyimide resin and cyanate resin, etc. Mixing or co-curing, this is because the dielectric constant of polyimide resin and cyanate resin is low; the second is to introduce F element into epoxy resin to synthesize epoxy resin with special structure, and C-F bond is stronger than C-H The bond has lower polarizability and smaller dipole, and the CF3 group has a larger free volume, but this method generally has a complicated synthesis process and high cost, which limits industrial applications; the third is that the research has a special structure The new curing agent is cured with epoxy to reduce the dielectric constant of the cured product; the fourth is to reduce the dielectric constant of epoxy resin by compounding with inorganic materials with micropores or mesoporous pores, such as cage-type silsesquioxane alkanes, mesoporous silica, montmorillonite, hollow glass microspheres, etc.