Chip bonding block manufacturing method and chip
A manufacturing method and soldering block technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid devices, etc., can solve problems such as electrochemical corrosion of chip soldering blocks, and achieve the effect of solving electrochemical corrosion and preventing corrosion
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[0024] The present invention will be described in detail below with reference to the drawings and specific embodiments.
[0025] The present invention provides a method for manufacturing a chip bonding block, refer to the attachment image 3 The process flow chart shown includes: step 301, growing a first passivation layer on a substrate forming a conductive structure; step 302, coating photoresist, performing photolithography, and etching the first passivation Layer forming the bonding pad window of the chip; step 303, removing the photoresist; step 304, performing a plasma passivation treatment to generate a second passivation layer on the surface of the bonding pad window, the second passivation The layer is a metal oxide film.
[0026] Wherein, the plasma passivation treatment is to place the chip in a dry degumming equipment in which oxygen or a mixed gas of oxygen and inert gas is introduced.
[0027] Wherein, the removing of the photoresist specifically includes: first placin...
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