A LED epitaxial growth method matching azo film
A technology of epitaxial growth and thin film, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of high production cost, expensive price, and harmful to human body
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Embodiment 1
[0052] The invention uses VEECO MOCVD to grow high-brightness GaN-based LED epitaxial wafers. Using high-purity H 2 or high purity N 2 or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As N source, metal-organic source trimethylgallium (TMGa), metal-organic source triethylgallium (TEGa), trimethylindium (TMIn) as indium source, N-type dopant is silane (SiH 4 ), trimethylaluminum (TMAl) as the aluminum source, and the P-type dopant as magnesium dicene (CP 2 Mg), the substrate is (0001) sapphire, and the reaction pressure is between 100Torr and 1000Torr. The specific growth method is as follows (for the epitaxial structure, please refer to figure 1 ):
[0053] The present invention provides a method for growing an LED epitaxial contact layer matching an AZO thin film current spreading layer, which includes: step 101, processing the substrate; step 102, growing a low-temperature GaN nucleation layer; step 103, growing a high-temperat...
Embodiment 2
[0059] The invention uses VEECO MOCVD to grow high-brightness GaN-based LED epitaxial wafers. Using high-purity H 2 or high purity N 2 or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As N source, metal-organic source trimethylgallium (TMGa), metal-organic source triethylgallium (TEGa), trimethylindium (TMIn) as indium source, N-type dopant is silane (SiH 4 ), trimethylaluminum (TMAl) as the aluminum source, and the P-type dopant as magnesium dicene (CP 2 Mg), the substrate is (0001) sapphire, and the reaction pressure is between 100Torr and 1000Torr. The specific growth method is as follows (for the epitaxial structure, please refer to figure 1 ):
[0060] 1. Treat the substrate, specifically:
[0061] H at 1050°C-1150°C 2 atmosphere, the sapphire is annealed and the substrate surface is cleaned.
[0062] 2. Growth of low-temperature GaN nucleation layer, specifically:
[0063] Cool down to 500°C-620°C, feed NH 3 and TMGa, ...
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