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Copper target material surface processing method

A processing method and technology for copper targets, which are applied to surface polishing machine tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of non-conformity with manufacturing, low yield of copper targets, and scrapped copper targets, etc. Achieve the effect of reducing repair rate and scrap rate, good surface color and roughness, and shortening cycle

Inactive Publication Date: 2017-01-25
合肥江丰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, processing the mirror surface of the copper target by machining can easily make the copper target scrapped, resulting in a low yield rate of the copper target, which does not meet the needs of production and manufacturing.

Method used

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  • Copper target material surface processing method
  • Copper target material surface processing method
  • Copper target material surface processing method

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Effect test

Embodiment Construction

[0028] The existing copper target mirror surface treatment method usually adopts mechanical processing method, which easily leads to the repair or scrapping of copper target material. After processing, there are also residual liquids such as oil stains and cutting fluids. The residual liquid oxidizes the copper target material seriously and is difficult to remove, and it is difficult to achieve the same surface roughness and color as the mirror surface of the copper target material made by mechanical processing. Lead to repair or scrap of copper target.

[0029] In order to solve the above problems, the present invention provides a method for treating the surface of a copper target, including: machining the mirror surface of the copper target; and then polishing the machined mirror surface of the copper target, the polishing process includes at least two secondary polishing process.

[0030] The present invention performs at least two polishing processes on the mirror surface...

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Abstract

The invention provides a copper target material surface processing method. The method includes the steps that a copper target material is provided and comprises a copper target material mirror surface; the copper target material mirror surface is machined; polishing processing is carried out on the machined copper target material mirror surface and includes two times of polishing processes. At least two times of polishing processes are adopted after machining, surface processing is carried out on the copper target material mirror surface, and scratches formed on the surface of the copper target material mirror surface by machining and an oxidation layer formed on the copper target material mirror surface by machining remaining liquid are removed by the polishing processes, so that surface glossiness and roughness of the copper target material mirror surface are higher, and the repair rate and rejection rate of the copper target material are reduced.

Description

technical field [0001] The invention relates to the field of target material processing, in particular to a method for treating the surface of a target material. Background technique [0002] The metal target is one of the most important raw materials in the manufacture of liquid crystal displays. The physical vapor deposition process is generally used in the manufacture of liquid crystal displays. During the physical vapor deposition process, the argon ions formed by ionization are accelerated under the action of an electric field, and the accelerated argon ions bombard The metal target forms a large number of target atoms, and a large number of sputtered target atoms are deposited on the substrate to form a thin film. [0003] In the actual manufacturing process, the roughness of the metal target surface will affect the stability of the sputtering rate of the target, which will lead to uneven thickness of the film formed on the substrate. Therefore, in order to ensure the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02
CPCB24B29/02
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽李健成
Owner 合肥江丰电子材料有限公司
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