Thermosetting resin composition, and resin varnish, metal foil with resin, resin film, metal-clad laminate, and printed wiring board using the same

Abstract

The invention provides a thermosetting resin composition capable of preventing a variation in in-plane dielectric constants while retaining excellent dielectric characteristics of a hardened product of a resin composition and preventing curling (warping) of a substrate material. There is provided a thermosetting resin composition including: (A) a modified polyphenylene ether compound which is terminal-modified by using a substituent having a carbon-carbon unsaturated double bond at a molecular terminal; (B) a styrene-butadiene copolymer having a number average molecular weight less than 10,000 and including 1,2 vinyl having cross-linking properties in molecules; (C) a hardening accelerator; and (D) an inorganic filler, in which a compound ratio of (A) component:(B) component is in a range of 80:20 to 20:80.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a resin varnish using the same, a resin film, a resin-coated metal foil, a metal-clad laminate, a printed wiring board, and the like. Background technique [0002] In recent years, electrical devices have been required to have dielectric properties such as low dielectric constant and low dielectric loss tangent, which are required for high-speed communication, due to the increase in the capacity of signals in electrical equipment. [0003] It is known that polyphenylene ether (PPE) has excellent dielectric properties such as dielectric constant and dielectric loss tangent, and also has excellent dielectric properties in the high frequency band (high frequency region) from the MHz band to the GHz band. Therefore, studies have been conducted on the use of polyphenylene ether as, for example, a high-frequency molding material. More specifically, polyphenylene ether has been studied as a ...

AI Technical Summary

Problems solved by technology

[0006] However, since the glass cloth forming the substrate material (prepreg) has a higher dielectric constant than the cured resin in the case of substrates through which high-speed and high-frequency signals exceeding 10 Gbps flow, there is a problem that in the presence of glass The part where the glass yarn is not present causes a local variation in the dielectric constant (Dk) in the substrate

In particular, in the high-frequency range, the single wavelength becomes millimeter units, so this deviation cannot be ignored, and there is a risk of adversely affecting high-level applications

[0007] So far, there have been reports of narrowing the gap between glass fibers, suppressing the variation in dielectric constant in the substrate surface, and suppressing the propagation delay time of signals by using an expanded glass cloth substrate. However, the gap between differential circuit wiring cannot be completely eliminated. Signal Propagation Delay Time

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